(19)
(11) EP 0 831 547 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
01.04.1998 Bulletin 1998/14

(43) Date of publication A2:
25.03.1998 Bulletin 1998/13

(21) Application number: 97116094.0

(22) Date of filing: 16.09.1997
(51) International Patent Classification (IPC)6: H01Q 9/04
(84) Designated Contracting States:
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 20.09.1996 JP 250140/96

(71) Applicant: MURATA MANUFACTURING CO., LTD.
Nagaokakyo-shi Kyoto-fu 226 (JP)

(72) Inventors:
  • Itoh, Shigekazu
    Nagaokakyo-shi, Kyoto-fu (JP)
  • Suzuki, Nobuhiko
    Nagaokakyo-shi, Kyoto-fu (JP)

(74) Representative: Schoppe, Fritz, Dipl.-Ing. et al
Schoppe & Zimmermann Patentanwälte Postfach 71 08 67
81458 München
81458 München (DE)

   


(54) Microstrip antenna


(57) A microstrip antenna (1) has a dielectric-made substrate (11). A first radiation-electrode (12) is formed on one main surface of the substrate (11). Second radiation-electrodes (13, 14) are formed on the periphery of the first radiation-electrode (12) with a spacing between the first radiation-electrode (12) and each of the second radiation electrodes (13, 14). A ground electrode (15) is formed on the other main surface of the substrate (11). A power-feeding through-hole 16 is provided at a position corresponding to the first radiation-electrode (12) on the substrate (11). A plurality of through-holes (17) are provided at positions corresponding to the second radiation-electrode (13) on the substrate (11). Capacitive-coupling portions (18a, 18b) are provided to capacitively couple the first radiation-electrode (12) and the second radiation-electrodes (13, 14), respectively. A connector (19), serving as a coaxial line, for feeding power to the first radiation electrode (12) is inserted into and past the feeding through-hole (16) from the other main surface of the substrate (11). The connector (19) is electrically connected to the first radiation-electrode (12) with solder (20a) and is fixed to the substrate (11) with solder (20a, 20b). The second radiation-electrodes (13, 14) are connected to the ground electrode (15) via the through-holes (17).






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