Covered wire connection method and structure

(19)

(11)

EP 0 834 956 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	07.10.1998 Bulletin 1998/41

(43)	Date of publication A2:
	08.04.1998 Bulletin 1998/15

(21)	Application number: 97117001.4

(22)	Date of filing: 30.09.1997

(51)	International Patent Classification (IPC)⁶: H01R 4/02

(84)	Designated Contracting States:
	AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV RO SI

(30)

Priority:

01.10.1996 JP 260928/96

(71)	Applicant: YAZAKI CORPORATION
	Minato-ku Tokyo 108 (JP)

(72)	Inventors:
	Ide, Tetsuro, c/o Yazaki Parts Co., Ltd. Haibara-gun, Shizuoka 421-04 (JP) Asakura, Nobuyuki., Yazaki Parts Co., Ltd. Haibara-gun, Shizuoka 421-04 (JP)

(74)	Representative: Füchsle, Klaus, Dipl.-Ing. et al
	Hoffmann Eitle, Patent- und Rechtsanwälte, Arabellastrasse 4 81925 München 81925 München (DE)

(54)	Covered wire connection method and structure

(57) Two covered wires (W1,W2) conductively connected are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips (13,15). By melting cover portions and pressing resin chips from outside, the conductive wire portions (1) of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips (13,15) are melt-fixed to each other to seal the connection portions. A crossing angle θ of the two covered wires (W1,W2) at the connection portion is set to not less than 45° to not greater than 135°. Thus, the covered wires can be conductively connected with each other at cheap price easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.

Search report