Low profile modular phone jack and method of making same

(19)

(11)

EP 0 851 538 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	20.01.1999 Bulletin 1999/03

(43)	Date of publication A2:
	01.07.1998 Bulletin 1998/27

(21)	Application number: 97122933.1

(22)	Date of filing: 29.12.1997

(51)	International Patent Classification (IPC)⁶: H01R 23/02

(84)	Designated Contracting States:
	AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

30.12.1996 US 774475

(71)	Applicant: MOLEX INCORPORATED
	Lisle Illinois 60532 (US)

(72)	Inventors:
	Roberts, James T. Oak Park, IL 60302 (US) Lenz, Lawrence E. Hampshire, IL 60140 (US)

(74)	Representative: Blumbach, Kramer & Partner GbR
	Patentanwälte, Sonnenberger Strasse 100 65193 Wiesbaden 65193 Wiesbaden (DE)

(54)	Low profile modular phone jack and method of making same

(57) A modular phone jack (10) includes an outer dielectric housing (12) having a plug-receiving opening (26) formed in a forward mating end (28) of the housing. An inner dielectric insert (14) is positionable in the housing. A plurality of elongated terminals (16) are fixed to the dielectric insert. Each terminal includes a contact portion (16b) at one end extending diagonally into the plug-receiving opening and a tail portion (16c) at the opposite end extending from the housing. A comb structure (22a) secures the tail portions to the housing at predetermined spaced locations. A method of fabricating the modular phone jack (10) according to the above structure is contemplated.

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