ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN - Patent 0853817

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EP 0 853 817 A1

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(43)	Date of publication:
	22.07.1998 Bulletin 1998/30

(21)	Application number: 96932706.0

(22)	Date of filing: 03.10.1996

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International Patent Classification (IPC):

H01L 23/ 12^{( . )}
H01L 23/ 498^{( . )}

H01L 23/ 31^{( . )}
H01L 23/ 64^{( . )}

(86)	International application number:
	PCT/GB1996/002420

(87)	International publication number:
	WO 1997/013275 (10.04.1997 Gazette 1997/16)

(84)	Designated Contracting States:
	DE GB IE

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Priority:

04.10.1995 WO 1995IT00161

(71)	Applicant: International Business Machines Corporation
	Armonk, N.Y. 10504 (US)

(72)	Inventors:
	GARBELLI, Francesco I-20043 Arcore (IT) OGGIONI, Stefano I-20059 Vimercate (IT)

(74)	Representative: Zerbi, Guido Maria, et al
	Intellectual Property Department, IBM United Kingdom Ltd., Hursley Park Winchester, Hampshire SO21 2JN Winchester, Hampshire SO21 2JN (GB)

(54)	ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN