EPOXY RESIN BASED SOLDER PASTE

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(11)

EP 0 870 329 A1

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(43)	Date of publication:
	14.10.1998 Bulletin 1998/42

(21)	Application number: 96928056.0

(22)	Date of filing: 09.08.1996

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International Patent Classification (IPC):

B23K 1/ 00^{( . )}
B23K 3/ 06^{( . )}
B23K 35/ 22^{( . )}
B23K 35/ 363^{( . )}
H01L 21/ 56^{( . )}
H05K 3/ 34^{( . )}

B23K 1/ 008^{( . )}
B23K 35/ 02^{( . )}
B23K 35/ 36^{( . )}
C08G 59/ 68^{( . )}
H05K 3/ 28^{( . )}
H05K 3/ 32^{( . )}

(86)	International application number:
	PCT/US1996/012761

(87)	International publication number:
	WO 1997/007542 (27.02.1997 Gazette 1997/10)

(84)	Designated Contracting States:
	DE DK FR GB IE IT NL SE

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Priority:

11.08.1995 US 19950514049
28.05.1996 US 19960644911

(71)	Applicant: Kirsten, Kenneth, J.
	Streamwood, IL 60107 (US)

(72)	Inventor:
	Kirsten, Kenneth, J. Streamwood, IL 60107 (US)

(74)	Representative: Müller, Frithjof E., Dipl.-Ing., et al
	Patentanwälte MÜLLER & HOFFMANN, Innere Wiener Strasse 17 81667 München 81667 München (DE)

(54)	EPOXY RESIN BASED SOLDER PASTE