(19)
(11) EP 0 877 709 A1

(12)

(43) Date of publication:
18.11.1998 Bulletin 1998/47

(21) Application number: 97901958.0

(22) Date of filing: 10.01.1997
(51) International Patent Classification (IPC): 
B01F 11/ 00( . )
B01F 15/ 02( . )
B65D 81/ 32( . )
H05K 3/ 12( . )
B01F 13/ 00( . )
B65D 30/ 22( . )
H05K 3/ 00( . )
H05K 3/ 28( . )
(86) International application number:
PCT/US1997/000319
(87) International publication number:
WO 1997/028053 (07.08.1997 Gazette 1997/34)
(84) Designated Contracting States:
AT BE CH DE ES FI FR GB IT LI NL SE

(30) Priority: 30.01.1996 US 19960593841

(71) Applicant: ENTHONE-OMI, Inc.
West Haven, Connecticut 06516 (US)

(72) Inventors:
  • McCAGUE, Ethan, J.
    Shelton, CT 06484 (US)
  • BURGESS, Thimothy, C.
    Clinton, CT 06413 (US)
  • FISCHER, Curtis, A.
    Stamford, CT 06903 (US)
  • STONE, David
    Clinton, CT 06413 (US)

(74) Representative: Kearney, Kevin David Nicholas, et al 
KILBURN & STRODE 20 Red Lion Street
London, WC1R 4PJ
London, WC1R 4PJ (GB)

   


(54) SOFT PACK PACKAGE AND DISPENSING SYSTEM FOR LIQUID PHOTOIMAGEABLE SOLDER MASK