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(11) | EP 0 881 671 A3 |
| (12) | EUROPEAN PATENT APPLICATION |
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| (54) | Method for fabricating semiconductor device |
| (57) A method for fabricating a semiconductor device, in which a semiconductor chip having
a first surface and a second surface substantially parallel to each other is mounted
on a submount such that the first surface faces the submount, includes: a first step
of applying resin to at least one of the semiconductor chip and the submount; a second
step of applying a pressure to the semiconductor chip and the submount so that the
semiconductor chip and the submount are bonded to each other by the resin, resulting
in electrical connection therebetween; and a third step of performing at least one
of a film formation process, an etching process, a patterning process, and a washing
process for the second surface of the semiconductor chip. |