POLYAMIDE BASED LAMINATING, COVERLAY, AND BOND PLY ADHESIVE WITH HEAT ACTIVATED CURE COMPONENT - Patent 0882108

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EP 0 882 108 A1

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(43)	Date of publication:
	09.12.1998 Bulletin 1998/50

(21)	Application number: 97907743.0

(22)	Date of filing: 21.02.1997

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International Patent Classification (IPC):

C09J 179/ 02^{( . )}
C08G 81/ 00^{( . )}
C09J 163/ 00^{( . )}
C09J 177/ 12^{( . )}
H05K 3/ 38^{( . )}

C08G 69/ 44^{( . )}
C08L 63/ 00^{( . )}
C09J 167/ 02^{( . )}
C09J 201/ 10^{( . )}

(86)	International application number:
	PCT/US1997/002701

(87)	International publication number:
	WO 1997/031078 (28.08.1997 Gazette 1997/37)

(84)	Designated Contracting States:
	DE FR GB IT NL

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Priority:

23.02.1996 US 19960012164P

(71)	Applicant: ICI AMERICAS INC.
	Wilmington, Delaware 19850-5391 (US)

(72)	Inventor:
	GARDESKI, Thomas, F. Tempe, AZ 85284-1539 (US)

(74)	Representative: Jones, Alan John, et al
	CARPMAELS & RANSFORD 43 Bloomsbury Square London, WC1A 2RA London, WC1A 2RA (GB)

(54)	POLYAMIDE BASED LAMINATING, COVERLAY, AND BOND PLY ADHESIVE WITH HEAT ACTIVATED CURE COMPONENT