Improved chemical mechanical polishing pad conditioner

(19)

(11)

EP 0 887 151 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	13.02.2002 Bulletin 2002/07

(43)	Date of publication A2:
	30.12.1998 Bulletin 1998/53

(21)	Application number: 98109958.3

(22)	Date of filing: 02.06.1998

(51)	International Patent Classification (IPC)⁷: B24B 37/04, B24B 53/00, B24B 55/06

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

27.06.1997 US 884118

(71)	Applicant: SIEMENS AKTIENGESELLSCHAFT
	80333 München (DE)

(72)	Inventor:
	Ploessl, Robert Glen Allen, VA 23060 (US)

(74)	Representative: Patentanwälte Westphal, Mussgnug & Partner
	Waldstrasse 33 78048 Villingen-Schwenningen 78048 Villingen-Schwenningen (DE)

(54)	Improved chemical mechanical polishing pad conditioner

(57) A polishing pad conditioner and a method for conditioning a polishing pad of a chemical/mechanical polishing system. The polishing pad conditioner includes a body defining an upper surface and a lower surface; at least one conditioning element mounted at the lower surface of the body, the conditioning element including a conditioning surface and an opening adjacent the conditioning surface; and a vacuum source operatively connected to the opening in the conditioning element. The method for conditioning a polishing pad includes the steps of holding a polishing pad conditioner including a conditioning element, a conditioning surface thereon and an opening in the conditioning element adjacent the conditioning surface in contact with a surface of the polishing pad; applying a vacuum source to the pad, the vacuum source being operatively connected to the conditioning element; and conditioning the surface of the polishing pad while simultaneously vacuuming particles therefrom.

Search report