| (19) |
 |
|
(11) |
EP 0 892 087 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
07.06.2000 Bulletin 2000/23 |
| (43) |
Date of publication A2: |
|
20.01.1999 Bulletin 1999/03 |
| (22) |
Date of filing: 11.06.1998 |
|
| (51) |
International Patent Classification (IPC)7: C25D 3/12 |
|
| (84) |
Designated Contracting States: |
|
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
Designated Extension States: |
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AL LT LV MK RO SI |
| (30) |
Priority: |
18.06.1997 US 50140 P
23.04.1998 US 64923
|
| (71) |
Applicant: ATOTECH Deutschland GmbH |
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10553 Berlin (DE) |
|
| (72) |
Inventor: |
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- Martyak, Nicholas
Doylestown, PA 18901 (US)
|
| (74) |
Representative: Stoner, Gerard Patrick et al |
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MEWBURN ELLIS York House 23 Kingsway
London WC2B 6HP
London WC2B 6HP (GB) |
|
| |
|
| (54) |
Electroplating of low-stress nickel |
(57) Nickel and nickel alloys can be electroplated from an aqueous acidic solution containing
nickel alkane sulfonic acid and a stress-reducing additive that imparts compressive
stress to an electrodeposit. The electroplating bath is acidic with a pH of 0 to 5.