Field of the Invention
[0001] The present invention relates to methods of providing diffuse risers on a fresnel
lens die.
Background of the Invention
[0002] Fresnel lenses include a series of optical facets, wherein each optical facet is
separated by a riser. That construction provides for a substantially planar lens useful
in many different applications.
[0003] One application in which fresnel lenses are particularly useful is in overhead projectors
where they help to focus light from beneath the stage and onto the mirror elevated
above the stage. In that application, however, light refracted through the risers
in the fresnel lens causes what is commonly referred to as "stage glare." Stage glare
typically affects the operator of the overhead projector by disrupting their view
of the materials on the stage of the projector.
[0004] Attempts to reduce stage glare have involved providing a diffuse surface on the risers
to diffuse the light refracted through those surfaces, thereby reducing the glare.
The diffuse risers have been provided by chemically etching or attacking the finished
lenses or the dies used to form the lenses. Typically the entire lens/die is treated,
including the optical facets as well as the risers. After etching, the optical facets
are recut or otherwise processed to restore them to a smooth, specular finish while
the risers remain etched to provide the desired diffuse surface.
[0005] Etching the lens itself to provide diffusing risers adds significantly to the cost
of the lens because each individual lens must be processed separately. Attempts at
etching the dies used to form stamped fresnel lenses have reduced stage glare to some
degree, but that approach is not compatible with all types of dies used to form lenses.
That is particularly true where the materials used to form the dies are not susceptible
to etching or, when etched, do not provide a surface that has the desired roughness
or diffusing properties.
[0006] Thus, a need exists for a process of providing diffuse risers on a fresnel lens die.
[0007] DE 38 35 567 discloses a method of providing diffusing risers on a fresnel lens die
achieved by applying a rough coating galvanically, chemically or thermally.
Summary of the Invention
[0008] The present invention includes methods of providing diffusing risers on a fresnel
lens die having a plurality of optical facets, wherein adjacent optical facets are
separated by a riser, according to claim 1.
[0009] Grain refiners and other impurities can be removed from the bath by filtering, typically
through activated charcoal and by allowing the temperature of the bath to rise to
about 30°C or higher, more preferably about 35°C or higher, and even more preferably
about 40°C or higher.
[0010] It may also be helpful to control the rate at which the diffusing layer is deposited
by controlling the current density used in the electrodeposition process. It is preferred
to control the current density to about 0.022 amps/cm
2 (20 amps/ft
2) or less, more preferably about 0.016 amps/cm
2 (15 amps/ft
2) or less, and even more preferably about 0.011 amps/cm
2 (10 amps/ft
2) or less.
[0011] Methods according to the present invention may also include masking selected portions
of the risers during the step of depositing the diffusing layer. The masking can be
maintained throughout the deposition process or it may occur during only a portion
of the process.
Brief Description of the Drawings
[0012]
Figure 1 is a cross-sectional schematic diagram of a fresnel lens die depicting the
optical facets and risers.
Figure 2 is a schematic diagram of one process according to the present invention.
Detailed Description of the Invention
[0013] Figure 1 is a cross-sectional diagram of a typical fresnel lens die 10 including
optical facets 12 separated by risers 14. The risers 14 provide the vertical displacement
between optical facets 12 that is required to produce a substantially planar lens
from the die 10. The die 10 is typically manufactured from metals such as brass, copper,
nickel, etc.
[0014] It will be understood that when the die 10 is a "negative" of the desired fresnel
lens, it can be used directly to produce a fresnel lens or, alternatively, a "mother"
can be electroformed from the die 10 and stampers (also a negative of the desired
lens) can then be electroformed from the mothers to produce fresnel lenses. Where
the die 10 is a "positive" of the desired fresnel lens, an electroformed copy will
be a negative of the lens and can be used to form the desired fresnel lens.
[0015] After the die 10 is formed, the method according to the present invention can be
used to provide the desired diffuse risers 14. The basic steps of the method are depicted
in the block diagram of Figure 2. First, a diffusing layer is deposited over the entire
surface of the die 10, including the optical facets 12 and risers 14. Second, the
optical facets 12 are processed to remove the diffusing layer and restore their specular
finish while leaving the diffusing layer on the risers 14. The processing typically
involves machining, or recutting, the optical facets 12 to remove the diffusing layer
from them while leaving the diffusing layer on the risers 14.
[0016] The diffusing layer is formed by electrodepositing a metal such as copper, nickel,
zinc, tin, cobalt, etc. Combinations of one or more of the metals may also be used
for the diffusing layer. The method of depositing the diffusing layer is electroplating
in a bath of electrolyte solution. The bath is substantially free of grain refiners
to enhance the diffusing properties of the diffusing layer. If an electrolyte solution
prepared with grain refiners is to be used, the bath can be filtered through activated
carbon to remove the grain refiners.
[0017] Additionally, the bath can be heated or allowed to heat up during processing to cause
degeneration of any grain refiners in the solution. The grain refiners degenerate
at elevated temperatures because they are typically organic and, thus, susceptible
to heat degeneration. Temperatures of the bath useful in connection with the present
invention can range from about 30°C or greater, more preferably about 35°C or greater,
and even more preferably about 40°C or greater.
[0018] The current density of the plating process (i.e., amps/plating area) can also play
a role in the uniformity of the diffusing layer on the surface of the die. It is preferred
that the current density be about 0.022 amps/cm
2 (20 amps/ft
2) or less, more preferably about 0.016 amps/cm
2 (15 amps/ft
2) or less, and even more preferably about 0. 011 amps/cm
2 (10 amps/ft
2) or less. It will be understood that the desire for plating speed, i.e., rate of
deposition, will typically be balanced with plating uniformity.
[0019] After the optical facets 12 have been processed, the die 10 can then be electroformed
or otherwise duplicated to form mothers or stampers if desired. Alternatively, the
die 10 itself could be used to form a fresnel lens.
[0020] In one preferred process, the diffusing layer deposited on the die 10 is matte copper.
The process used to electrodeposit the matte copper is described in Example 1 below.
The matte finish is provided by electroplating the die 10 in a bath that is substantially
free of grain refiners. This produces a finish in the matte copper that is grainier
than typically found in electrodeposited copper layers.
Examples
[0021] Features and advantages of the methods according to the present invention are further
illustrated in the examples. It is recognized, however, that while the examples serve
this purpose, the particular ingredients and amounts used, as well as other conditions
and details, are not to be construed in a manner that would unduly limit the scope
of this invention.
Example 1
[0022] A fresnel lens die master having a surface area of about 0.2 square meters manufactured
of nickel was electroplated with a diffusing layer of matte copper according to the
following procedure. An electroplating solution was prepared including copper sulfate
(0.21 kg/liter of solution) (copper sulfate pentahydrate sold as Triangle Brand by
Phelps Dodge Refining Corporation, El Paso, Texas), sulfuric acid (0.061 kg/liter
of solution) (96% pure, reagent grade), chloride (50 PPM), and a surfactant (1 liter
of 10% Duponal ME per 757 liters of solution, available from DuPont). The balance
of the solution was distilled water. The solution was filtered through a 1 micrometer
filter and activated carbon to remove impurities before plating.
[0023] Before electroplating, the die was soaked in MEK/acetone solvent bath to remove oils
and other contaminants on the surface of the die. The die was then power washed with
a 20% Advanage™ cleaner solution (Advanage™ is available from Austin Diversified Products,
Inc., Harvey, Illinois). After power washing, the die was maintained wet in a solution
of 20% H
2SO
4 and 5% Advanage™ (balance distilled water) while it was mounted on the electroplating
equipment.
[0024] To insure adhesion of the matte copper diffusing layer, the nickel die was first
reverse plated for one minute at 25 amps with the die being the anode. Plating was
then commenced after reversing polarity (i.e., the die was the cathode) and plating
was carried out for about two hours at 20 amps for a total of 42 amp-hours. During
plating, the electroplating solution was held at a temperature of 35°C, the die was
rotated in the solution at 3 0 revolutions per minute, the electroplating solution
was agitated with a mixer and the solution was recirculated through a 1 micrometer
filter at a rate of 114 liters per minute.
[0025] The resulting die appeared uniformly coated with a layer of matte copper.
Example 2
[0026] A second nickel die essentially identical to the die used in Example 1 was electroplated
under the same conditions as set out in Example 1, except that the electroplating
was carried out at 42 amps for a total of 42 amp-hours.
[0027] The finished die did not appear as uniformly plated as the die produced according
to Example 1.
Example 3
[0028] A copper die with a similar pattern and size as the nickel dies used in Examples
1 and 2 was plated with matte copper according to the process described in Example
1 with the following exceptions: the temperature of the bath during plating was 40°C;
the plating was carried out for about 40 minutes at 13-15 amps for a total of 11 amp-hours.
[0029] The resulting die had a uniform satin appearance. When a nickel electroform was produced
using the die, virtually none of the matte copper was removed by the electroformed
copy.
Example 4
[0030] A copper die was electroformed according to Example 3, with the following exception:
during plating, a mask was placed with the logo of Minnesota Mining and Manufacturing
Company ("3M") over the die for about one-half of the total plating time. The logo
was provided of a magnetic material that adhered to the nickel substrate on which
the copper surface was mounted. Because no further plating occurred in the area underneath
the mask after its placement, the plating thickness was reduced in the area covered
by the mask, resulting in the logo being transferred to the die. Lenses that were
ultimately manufactured from this die also exhibited the logo when viewed from an
angle, i.e., not normal to the plane of the lens.
[0031] Various modifications and alterations of this invention will become apparent to those
skilled in the art without departing from the scope of this invention, and it should
be understood that this invention is not to be unduly limited to the illustrative
embodiments set forth herein.
1. A method of providing diffusing risers on a fresnel lens die having a plurality of
optical facets, wherein adjacent optical facets are separated by a riser, the method
comprising the steps of:
a) depositing a diffusing layer on the plurality of optical facets and the risers,
wherein the depositing comprises electrodepositing a layer of metal chosen from the
group consisting of copper, nickel, zinc, cobalt, tin, and combinations thereof, and
further wherein the electrodepositing is performed in a bath substantially free of
grain refiners; and
b) selectively removing the diffusing layer from the plurality of optical facets,
wherein the diffusing layer remains substantially intact on the risers.
2. A method according to claim 1, wherein the step of depositing further comprises depositing
the diffusing layer on a die having generally concentric optical facets.
3. A method according to claim 1, wherein the step of depositing further comprises depositing
the diffusing layer on a die having generally parallel optical facets.
4. A method according to any of claims 1-3, further comprising a step of passing the
bath through activated charcoal.
5. A method according to any of claims 1-4, further comprising a step of heating the
bath to a temperature of about 30°C or higher.
6. A method according to any of claims 1-4, further comprising a step of heating the
bath to a temperature of about 35°C or higher.
7. A method according to any of claims 1-4, further comprising a step of heating the
bath to a temperature of about 40°C or higher.
8. A method according to any of claims 1-7, further comprising masking selected portions
of the risers during the step of depositing the diffusing layer.
9. A method according to any of claims 1-7, further comprising masking selected portions
of the risers during a portion of the time during which the step of depositing is
being performed.
10. A method according to any of claims 1-9, wherein the step of depositing further comprises
passing electrical energy through the die having a current density of about 0.022
amps/cm2 or less.
11. A method according to any of claims 1-9, wherein the step of depositing further comprises
passing electrical energy through the die having a current density of about 0.016
amps/cm2 or less.
12. A method according to any of claims 1-9, wherein the step of depositing further comprises
passing electrical energy through the die having a current density of about 0.011
amps/cm2 (10 amps/ft2) or less.
1. Verfahren zur Herstellung streuender Flanken auf einer Fresnellinsenmatrize mit mehreren
optischen Facetten, wobei benachbarte optische Facetten durch eine Flanke getrennt
sind, wobei das Verfahren die folgenden Schritte aufweist:
a) Abscheiden einer Streuschicht auf die mehreren optischen Facetten und die Flanken,
wobei das Abscheiden das elektrochemische Abscheiden einer Schicht aus Metall aufweist,
das aus der Gruppe ausgewählt ist, die aus Kupfer, Nickel, Zink, Cobalt, Zinn und
deren Kombinationen besteht, und wobei ferner das elektrochemische Abscheiden in einem
Bad durchgeführt wird, das im wesentlichen frei von Kornverfeinerern ist; und
b) selektives Entfernen der Streuschicht von den mehreren optischen Facetten, wobei
die Streuschicht auf den Flanken im wesentlichen intakt bleibt.
2. Verfahren nach Anspruch 1, wobei der Schritt des Abscheidens ferner das Abscheiden
der Streuschicht auf eine Matrize aufweist, die allgemein konzentrische optische Facetten
hat.
3. Verfahren nach Anspruch 1, wobei der Schritt des Abscheidens ferner das Abscheiden
der Streuschicht auf eine Matrize aufweist, die allgemein parallele optische Facetten
hat.
4. Verfahren nach einem der Ansprüche 1 bis 3, ferner mit einem Schritt des Durchleitens
des Bads durch Aktivkohle.
5. Verfahren nach einem der Ansprüche 1 bis 4, ferner mit einem Schritt des Erwärmens
des Bads auf eine Temperatur von mindestens etwa 30 °C.
6. Verfahren nach einem der Ansprüche 1 bis 4, ferner mit einem Schritt des Erwärmens
des Bads auf eine Temperatur von mindestens etwa 35 °C.
7. Verfahren nach einem der Ansprüche 1 bis 4, ferner mit einem Schritt des Erwärmens
des Bads auf eine Temperatur von mindestens etwa 40 °C.
8. Verfahren nach einem der Ansprüche 1 bis 7, ferner mit dem Maskieren ausgewählter
Abschnitte der Flanken während des Schritts des Abscheidens der Streuschicht.
9. Verfahren nach einem der Ansprüche 1 bis 7, ferner mit dem Maskieren ausgewählter
Abschnitte der Flanken während eines Abschnitts der Zeit, in der der Schritt des Abscheidens
durchgeführt wird.
10. Verfahren nach einem der Ansprüche 1 bis 9, wobei der Schritt des Abscheidens ferner
das Durchleiten elektrischer Energie durch die Matrize mit einer Stromdichte von höchstens
etwa 0,022 A/cm2 aufweist.
11. Verfahren nach einem der Ansprüche 1 bis 9, wobei der Schritt des Abscheidens ferner
das Durchleiten elektrischer Energie durch die Matrize mit einer Stromdichte von höchstens
0,016 A/cm2 aufweist.
12. Verfahren nach einem der Ansprüche 1 bis 9, wobei der Schritt des Abscheidens ferner
das Durchleiten elektrischer Energie durch die Matrize mit einer Stromdichte von höchstens
etwa 0,011 A/cm2 (10 A/ft2) aufweist.
1. Procédé de création de plans verticaux de diffusion dans un moule pour lentilles de
fresnel comprenant une pluralité de facettes optiques, dans lequel les facettes optiques
adjacentes sont séparées par un plan vertical, le procédé comprenant les étapes consistant
à :
a) déposer une couche de diffusion sur la pluralité des facettes optiques et des plans
verticaux, dans lequel l'étape consistant à déposer la couche de diffusion comprend
l'étape consistant à déposer par électrodéposition une couche de métal choisi à partir
du groupe comprenant le cuivre, le nickel, le zinc, le cobalt, l'étain, ainsi que
des combinaisons de ceux-ci et dans lequel, en outre, l'étape consistant à déposer
par électrodéposition la couche de métal est réalisée dans des bains d'agents de raffinage
sensiblement exempts de grains ; et
b) éliminer de façon sélective la couche de diffusion de la pluralité des facettes
optiques, dans lequel la couche de diffusion demeure sensiblement intacte sur les
plans verticaux.
2. Procédé selon la revendication 1, dans lequel l'étape consistant à déposer la couche
de diffusion comprend en outre l'étape consistant à déposer la couche de diffusion
dans un moule comprenant généralement des facettes optiques concentriques.
3. Procédé selon la revendication 1, dans lequel l'étape consistant à déposer la couche
de diffusion comprend en outre l'étape consistant à déposer la couche de diffusion
dans un moule comprenant généralement des facettes optiques parallèles.
4. Procédé selon l'une quelconque des revendications 1 à 3, comprenant en outre une étape
consistant à faire passer le bain à travers du charbon actif.
5. Procédé selon l'une quelconque des revendications 1 à 4, comprenant en outre une étape
consistant à chauffer le bain à une température de 30°C environ ou plus.
6. Procédé selon l'une quelconque des revendications 1 à 4, comprenant en outre une étape
consistant à chauffer le bain à une température de 35°C environ ou plus.
7. Procédé selon l'une quelconque des revendications 1 à 4, comprenant en outre une étape
consistant à chauffer le bain à une température de 40°C environ ou plus.
8. Procédé selon l'une quelconque des revendications 1 à 7, comprenant en outre une étape
consistant à masquer des parties sélectionnées des plans verticaux au cours de l'étape
consistant à déposer la couche de diffusion.
9. Procédé selon l'une quelconque des revendications 1 à 7, comprenant en outre une étape
consistant à masquer des parties sélectionnées des plans verticaux au cours d'une
partie de la durée pendant laquelle l'étape consistant à déposer la couche de diffusion
est réalisée.
10. Procédé selon l'une quelconque des revendications 1 à 9, dans lequel l'étape consistant
à déposer la couche de diffusion comprend l'étape consistant à faire passer une énergie
électrique à travers le moule ayant une densité de courant de 0,022 amp/cm2 environ ou moins.
11. Procédé selon l'une quelconque des revendications 1 à 9, dans lequel l'étape consistant
à déposer la couche de diffusion comprend l'étape consistant à faire passer une énergie
électrique à travers le moule ayant une densité de courant de 0,016 amp/cm2 environ ou moins.
12. Procédé selon l'une quelconque des revendications 1 à 9, dans lequel l'étape consistant
à déposer la couche de diffusion comprend l'étape consistant à faire passer une énergie
électrique à travers le moule ayant une densité de courant de 0,011 amp/cm2 (10 amp/ft2) environ ou moins.