DIFFUSION BONDED SPUTTERING TARGET ASSEMBLY WITH PRECIPITATION HARDENED BACKING PLATE AND METHOD OF MAKING SAME

(19)

(11)

EP 0 904 423 A1

(12)

(43)	Date of publication:
	31.03.1999 Bulletin 1999/13

(21)	Application number: 97952525.0

(22)	Date of filing: 04.12.1997

(51)

International Patent Classification (IPC):

C22F 1/ 00^{( . )}
C21D 1/ 18^{( . )}
C22F 1/ 04^{( . )}
C22F 1/ 18^{( . )}

C21D 1/ 06^{( . )}
C22C 21/ 00^{( . )}
C22F 1/ 08^{( . )}
C23C 14/ 34^{( . )}

(86)	International application number:
	PCT/US1997/023414

(87)	International publication number:
	WO 1998/026107 (18.06.1998 Gazette 1998/24)

(84)	Designated Contracting States:
	AT BE CH DE DK ES FI FR GB IE IT LI LU NL PT SE

(30)

Priority:

13.12.1996 US 19960766629

(71)	Applicant: JOHNSON MATTHEY ELECTRONICS INC
	Spokane, Washington 99216 (US)

(72)	Inventors:
	BEIER, Anthony, F. Spokane, WA 99216 (US) KARDOKUS, Janine, K. Otis Orchards, WA 99027 (US) STROTHERS, Susan, D. Spokane, WA 99207 (US)

(74)	Representative: Lawrence, John Gordon
	McNeight & Lawrence Regent House Heaton Lane Stockport, Cheshire SK4 1BS Stockport, Cheshire SK4 1BS (GB)

(54)	DIFFUSION BONDED SPUTTERING TARGET ASSEMBLY WITH PRECIPITATION HARDENED BACKING PLATE AND METHOD OF MAKING SAME