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(11) | EP 0 905 752 A2 |
| (12) | EUROPEAN PATENT APPLICATION |
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| (54) | Method for fabricating conductive electrode for semiconductor device |
| (57) Method for fabricating a semiconductor device, is disclosed, which is suitable for
improving a step coverage and a resistivity, including the steps of forming a doped
silicon layer on a substrate, and forming a silicide layer containing excessive metal
on the doped silicon layer. |
BACKGROUND OF THE INVENTION
Field of the Invention
[0001] The present invention relates to a semiconductor device, and more particularly, to a method for fabricating a semiconductor device, which is suitable for improving a step coverage and a resistivity.
Discussion of the Related Art
[0002] In general, as the semiconductor devices are highly integrated, a width of wiring in the semiconductor devices is reduced, causing problems, such as drop in operation speed due to consequential increase of a resistance of the wiring. And, the formation of a thicker wiring as a wiring width is reduced used as a counter measure on the increased sheet resistivity of the wiring causes a problem that a fabrication process for the device becomes complicated with less yield because of a greater step coverage of the wiring. In order to solve these problems, a refractory metal silicide, such as tungsten silicide (WSix), titanium silicide(TiSi2), or cobalt silicide(CoSi2) is formed on a polysilicon layer in an intention for preventing an increase of resistivity (hereafter, a refractory metal silicide formed on a polysilicon layer is called "polycide"). However, though this can improve the resistivity and step coverage to a some extent, a method for forming a polycide which can improve further is in need.
[0003] A conventional method for fabricating a semiconductor device will be explained with reference to the attached drawings. Figs. 1a ∼ 1c illustrate sections showing process steps of a first conventional method for fabricating a semiconductor device, and Figs. 2a ∼ 2c illustrate sections showing process steps of a second conventional method for fabricating a semiconductor device. A polycide fabrication process used for reducing a resistivity and a step coverage in a semiconductor device can be applied to a process for forming a gate electrode or a bitline.
[0004] The process steps of the first conventional method for fabricating a semiconductor device in which the polycide fabrication process is applied to formation of a gate electrode will be explained.
[0005] Referring to Fig. 1a, the process starts with deposition of a first oxide film 2 on a semiconductor substrate 1 and deposition of a polysilicon layer 3 on the first oxide film 2. The polysilicon layer 3 is doped with P type impurities and soluble in water. The doping of the polysilicon layer 3 may be done by ion injection after deposition of the polysilicon layer 3 is completed, or by deposition of POCl3, or by a continuous injection of a doping gas, such as PH3, while depositing the polysilicon layer. For removing a natural oxide film(or glass) which may remain on the polysilicon layer 3 during the process of forming the polysilicon 3 as shown in Fig. 1b, the process resultant is dipped into HF solution for cleaning. A chemical vapor deposition of SiH4 or SiH2Cl2 with tungsten hexafluoride(WF6) gas is conducted to form a tungsten silicide layer 4, to form a polycide layer. As shown in Fig. 1c, the tungsten silicide layer 4, polysilicon layer 3 and the first oxide film 2 are subjected to photolithography to make an anisotropic etching of the layers 2, 3 and 4 with a mask for forming a gate electrode used, resulting to form a stack of a gate cap silicide layer 4a, a gate electrode 3a and a gate oxide film 2a. A lightly doped drain(LDD) region 5 is formed in the semiconductor substrate 1 on each side of the gate electrode 3a. A second oxide film is deposited on the entire surface and subjected to anisotropic etching to remove the second oxide film, forming sidewall insulating films 6 on both sides of the gate cap silicide layer 4a, gate electrode 3a and gate oxide film 2a. Portions of the semiconductor substrate 1 on outward sides of the sidewall insulating films 6, excluding a portion under the gate electrode 3a, are heavily doped, to form source/drain regions 7 therein.
[0006] The process steps of the second conventional method for fabricating a semiconductor device in which the polycide fabrication process is applied to formation of a bitline will be explained.
[0007] Referring to Fig. 2a, the process steps start with formation of an N type impurity doped layer 8 in a portion of a P type semiconductor substrate 1. A chemical vapor deposition is conducted to form an interlayer insulating layer 9 on the semiconductor substrate 1, which is selectively removed to form a contact hole 10 exposing the N type impurity doped layer 8. As shown in Fig. 2b, a polysilicon layer 11 is formed on the entire surface. The polysilicon layer 11 is doped with P type impurities and soluble in water. The doping of the polysilicon layer 11 may be done by ion injection after deposition of the polysilicon layer 3 is completed, or by deposition of POCl3, or by a continuous injection of a doping gas, such as PH3, while depositing the polysilicon layer. For removing a natural oxide film(or glass) which may remain on the polysilicon layer 11 during the process of forming the polysilicon 11 as shown in Fig. 2c, the process resultant is dipped into HF solution for cleaning. A chemical vapor deposition of SiH4 or SiH2Cl2 with tungsten hexafluoride(WF6) gas is conducted to form a tungsten silicide layer 12 on the polysilicon layer 11, which is subjected to selective patterning to form a bitline of the polycide layer.
[0008] In the conventional polycide fabrication process, a doped polysilicon layer is formed on a substrate, and the polysilicon layer is cleaned with HF solution to remove a natural oxide film present on the surface of the polysilicon layer, which is then placed in a chamber and maintained at an elevated temperature over 500 deg. C while injecting SiH4 or SiH2Cl2 and WF6 gases into the chamber, to form tungsten silicide(WSix) on the doped polysilicon layer. In comparison to a tungsten silicide(WSix) with 2<x≤3.2, the aforementioned tungsten silicide contains excessive silicon. If the tungsten silicide containing excessive silicon is subjected to heat treatment a resistivity of the tungsten silicide is lowered compared to the case when the tungsten silicide is not formed, resulting in an improvement in operational characteristics of the device.
[0009] However, the conventional method for fabricating a semiconductor device has the following problems.
[0010] First, the cleaning of the doped polysilicon with HF solution for removing the natural oxide film present on the surface of the doped polysilicon causes to leave an undoped polysilicon layer on the surface of the doped polysilicon layer. And, the formation of tungsten silicide on the doped polysilicon layer with an undoped polysilicon surface leads to form a silicon excess tungsten silicide which has a resistivity higher than 100 µΩ·cm even after heat treatment despite the fabrication process becomes stable. Therefore, in order to lower the resistivity of 200 µΩ·cm of polysilicon in formation of a gate electrode, though the tungsten silicide layer is formed on the polysilicon layer by applying the conventional polycide fabrication process, the tungsten silicide layer can only lower the resistivity of the polysilicon layer by approximately halt, that is not enough for a highly integrated device in which a line width is reduced below 0.25 µm.
[0011] Second, a bitline formed with a tungsten silicide layer formed reduced by SiH4 or SiH2Cl2 according to the second conventional method has a step coverage greater than a bitline formed with a tungsten metal layer. Due to this, a problem is caused that the bitline can not fully fill a contact hole in a device fabrication process which involves a contact hole size below 0.25 µm with an aspect ratio greater than 3 as shown in Fig. 2c.
SUMMARY OF THE INVENTION
[0012] Accordingly, the present invention is directed to a method for fabricating a semiconductor device that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
[0013] An object of the present invention is to provide a method for forming a metal silicide which is suitable for improving a step coverage and resistivity, and a method for fabricating a semiconductor device applying the same.
[0014] Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
[0015] To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, the method for fabricating a semiconductor device includes the steps of forming an insulating layer on a semiconductor substrate, forming a doped silicon layer on the insulating layer, and forming a silicide layer containing excessive metal on the doped silicon layer.
[0016] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention:
[0018] In the drawings:
Figs. 1a ∼ 1c illustrate sections showing process steps of a first conventional method for fabricating a semiconductor device;
Figs. 2a ∼ 2c illustrate sections showing process steps of a second conventional method for fabricating a semiconductor device;
Figs. 3a ∼ 3c illustrate sections showing process steps of a method for fabricating a semiconductor device in accordance with a first preferred embodiment of the present invention;
Figs. 4a ∼ 4d illustrate sections showing process steps of a method for fabricating a semiconductor device in accordance with a second preferred embodiment of the present invention;
Fig. 5 illustrates a section showing a method for forming a metal silicide in accordance with a third preferred embodiment of the present invention;
Fig. 6 illustrates a graph showing a PH3 flow rate vs. a resistivity of a tungsten silicide layer(WSix) in deposition of a polysilicon layer according to the method for fabricating a semiconductor device of the present invention;
Fig. 7 illustrates a graph showing a sputtering time vs. a silicon atoms/tungsten atoms ratio in a tungsten silicide layer(WSix) for different PH3 flow rates in deposition of a polysilicon layer according to the present invention;
Fig. 8 illustrates a graph showing a deposition temperature of a tungsten silicide layer (WSix) vs. a composition of the tungsten silicide layer of the present invention; and,
Fig. 9 illustrates a graph showing a reaction temperature of a tungsten silicide layer formed according to different source gases injected into a doped polysilicon layer of the present invention vs. formation energy.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0019] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Figs. 3a ∼ 3c illustrate sections showing process steps of a method for fabricating a semiconductor device in accordance with a first preferred embodiment of the present invention, and Figs 4a ∼ 4d illustrate sections showing process steps of a method for fabricating a semiconductor device in accordance with a second preferred embodiment of the present invention. The polycide fabricating process used for reducing a resistivity of a semiconductor device is applicable to formation of a gate electrode and a bitline.
[0020] Referring to Fig. 3a, the method for fabricating a semiconductor device in accordance with a first preferred embodiment of the present invention starts with depositing a first oxide film 22 on a semiconductor substrate 21 to a thickness of 80 Å. Then, an ICT(Integrated Cluster Tool) is used for forming a doped polysilicon layer 23 to a thickness of 1000 Å at 660 deg. C and 80 Torr. The polysilicon layer 23 is deposited using a source gas of H2 containing 50% of SiH4 and 1% of PH3. Then, the semiconductor substrate 21 with the doped polysilicon layer 23 deposited thereon is transferred to a chamber for use in depositing a first tungsten silicide layer 24 without exposure to the atmosphere(i.e., without breakage of a vacuum). Then, the first tungsten silicide layer 24 is deposited on the polysilicon layer 23. The first tungsten silicide layer 24 is deposited using WF6 and SiH4 or SiH2Cl2 and WF6 gases as source gases; if WF6 and SiH4 are used, the flow rates are 4 and 175 sccm respectively, and the deposition pressure is fixed at 0.9 Torr while varying deposition temperature in a range of 500 ∼ 600 deg. C, resulting to deposit a tungsten silicide layer containing an excessive tungsten. That is, a tungsten silicide layer satisfying a condition of 0.5≤x<2 in WSix is deposited. If the first tungsten silicide layer 24 is deposited at a temperature below 555 deg. C, the first tungsten silicide layer 24 is converted into amorphous, and If the first tungsten silicide layer 24 is deposited at a temperature above 555 deg. C, the first tungsten silicide layer 24 has amorphous phases and crystalline phases existing together. And because the doped polysilicon layer 23 is not exposed to the atmosphere during formation of the first tungsten silicide layer 24, that eliminates the conventional requirement for cleaning with HF solution for removing the natural oxide film, no undoped layer is formed on the surface of the doped polysilicon layer, causing the first tungsten silicide layer 24 to contain more tungsten atoms than silicon atoms. As shown in Fig. 3b, RTA(Rapid Thermal Annealing) is conducted at a temperature in a range of 400 ∼ 1100 deg. C(most preferably 900 ∼ 1000 deg. C) for 30 seconds under a gaseous ambient containing nitrogen atoms, such as nitrogen(N2), argon(Ar), or NH3. In this instance, the excessive tungsten atoms in the first tungsten silicide 24 and the doped polysilicon layer 23 make reaction leading to form a second tungsten silicide layer 24a having a tetragonal phase crystal structure. The second tungsten silicide layer 24a, having a tetragonal phase crystal structure, has a lower resistivity than the resistivity of the conventional heat treated silicon excess tungsten silicide. And, the silicon nitride film 25 formed on the surface of the second tungsten silicide layer 24a in the process of the heat treatment of the first tungsten silicide layer 24 under a gaseous ambient containing nitrogen atoms, not only prevents diffusion of N type or P type dopant, but also can be used as a protection film. As shown in Fig. 3c, a mask for forming a gate electrode is used in an anisotropic etching of the second tungsten silicide layer 24, the polysilicon layer 23 and the first oxide film 22, to form a gate cap silicide layer 24b, a gate electrode 23a, and a gate oxide film 22a. LDD(Lightly Doped Drain) regions 26 are formed in the semiconductor substrate 21 on both sides of the gate electrode 23a, and a second oxide film is formed on the entire surface and subjected to anisotropic etching to remove the second oxide film to form sidewall insulating films 27 at sides of the gate cap nitride film 25a, the gate cap tungsten silicide film 24b, the gate electrode 23a and the gate oxide film 22a. Then, portions of the semiconductor substrate 21 on both sides of the sidewall insulating films 27 excluding the gate electrode 23a are heavily doped to form source/drain regions 28 therein.
[0021] Next, a method for fabricating a semiconductor device in accordance with a second embodiment of the present invention as applied to bitline formation will be explained.
[0022] Referring to Fig. 4a, N type impurity ions are injected into a P type semiconductor substrate 21 to form an N type impurity injected layer 29 in a certain portion of the P type semiconductor substrate 21. An interlayer insulating layer 31 of a nitride film or oxide film is deposited on the entire surface and subjected to anisotropic etching to expose the N type impurity injected layer 29, to form a contact hole 30 on the N type impurity injected layer 29. As shown in Fig. 4b, a polysilicon layer 32 is deposited on the surface in the contact hole 30 and on the interlayer insulating layer 31. In this instance, the polysilicon layer 32 is deposited using a source gas of H2 containing 50 % SiH4 and 1 % PH3. Then, as shown in Fig. 4c, the semiconductor substrate 21 with the doped polysilicon layer 32 deposited thereon is transferred to a chamber for use in depositing a first tungsten silicide layer 33 without exposure to the atmosphere. Then, the first tungsten silicide layer 33 is deposited on the polysilicon layer 32. As explained in association with Fig. 3a, the first tungsten silicide layer 33 is deposited using WF6 and SiH4 or SiH2Cl2 and WF6 gases as source gases; if WF6 and SiH4 are used, the flow rates are 4 and 175 sccm respectively, and the deposition pressure is fixed at 0.9 Torr while varying deposition temperature in a range of 500 ∼ 600 deg. C resulting to deposit a tungsten silicide layer containing an excessive tungsten. That is, a tungsten silicide layer satisfying a condition of 0.5≤x<2 in WSix is deposited. If the first tungsten silicide layer 33 is deposited at a temperature below 555 deg. C, the first tungsten silicide layer 33 is converted into amorphous, and If the first tungsten silicide layer 33 is deposited at a temperature above 555 deg. C, the first tungsten silicide layer 33 has amorphous phases and crystalline phases existing together. And, because the doped polysilicon layer 32 is not exposed to the atmosphere during formation of the first tungsten silicide layer 33, that eliminates the conventional requirement for cleaning with HF solution for removing the natural oxide film, no undoped layer is formed on the surface of the doped polysilicon layer, causing the first tungsten silicide layer 33 to contain more tungsten atoms than silicon atoms. As shown in Fig. 4d, RTA(Rapid Thermal Annealing) is conducted at a temperature in a range of 400 ∼ 1100 deg. C(most preferably 900 ∼ 1000 deg. C) for 30 seconds under a gaseous ambient containing nitrogen atoms, such as nitrogen(N2), argon(Ar), or NH3. In this instance, the excessive tungsten atoms in the first tungsten silicide layer 33 and the doped polysilicon layer 32 make reaction leading to form a second tungsten silicide layer 33a having a tetragonal phase crystal structure. The second tungsten silicide layer 33a, having a tetragonal phase crystal structure, has a lower resistivity than the resistivity of the conventional heat treated silicon excess tungsten silicide, because the second tungsten silicide 33a has a grain size greater than a grain size of the conventional tungsten silicide layer. And, when the first tungsten silicide layer 33 is heat treated in a gaseous ambient containing nitrogen atoms, as the grain size thus becomes greater, the silicon atoms existing in the first tungsten silicide layer 33 are segregated to the surface of the first tungsten silicide layer 33, to form a silicon nitride film 34 on the surface of the second tungsten silicide layer 33a, consuming the polysilicon layer 32 to cause its thickness thinner. The silicon nitride film 34 prevents the N type or P type dopant in the polysilicon layer 32 from being diffused. And, the first tungsten silicide layer 33 may be injected of ions before the RTA process, to convert the first tungsten silicide layer 33 into amorphous That is, as the first tungsten silicide layer 33 has a crystalline layer on an amorphous layer, ions of phosphorus(P), boron( B), or arsenic(As) are injected into the crystalline layer to a dose oil 1E15 ∼ 5E15 cm-3 at an injection energy of 45 ∼ 55 KeV in case of phosphorus(P), of 10 ∼ 20 KeV in case of boron(B), and of 55 ∼ 65 KeV in, case of arsenic(As).
[0023] The second tungsten silicide layer 33a of the present invention is better than the conventional tungsten silicide(WSi2) layer which is formed by heat treating a tungsten in that the second tungsten silicide layer 33a of the present invention has no possibility of defect occurrence during fabrication coming from excessive reaction of the silicon atoms present on the semiconductor substrate 21 before formation of the second tungsten silicide layer 33a with the semiconductor substrate 21 during the heat treatment. Thus, the method for fabricating a semiconductor device in accordance with the second embodiment of the present invention is completed.
[0024] In the third embodiment of the present invention, a silicon layer is formed on upper and under sides of a metal silicide layer in a method for forming a gate electrode or a data line. Fig. 5 illustrates a section showing a method for forming a metal silicide in accordance with a third preferred embodiment of the present invention.
[0025] An ICT(Integrated Cluster Tool) is used in formation of a first polysilicon layer 41 at 660 deg. C and 80 Torr to a thickness of 1000 Å and the first polysilicon layer 41 is doped. Or, alternatively, the doped polysilicon layer 41 may be obtained by depositing a polysilicon layer using a source gas of H2 containing 50 % SiH4 and 1 % PH3. The substrate having the first polysilicon deposited thereon is transferred to a chamber for use in deposition of a first tungsten silicide layer 42 without exposure to the atmosphere(i.e., without breakage of a vacuum), and then the first tungsten silicide layer 42 is formed on the doped first polysilicon layer 41. In this instance the first tungsten silicide layer 42, which can be formed according to a method identical to the first or second embodiment methods, is amorphous or amorphous and crystalline existing together and contains excessive tungsten. And, a second polysilicon layer 43 is formed on the first tungsten silicide layer 42 to a thickness of 0.05 ∼ 0.4 times of the tungsten silicide layer 42, and subjected to RTA(Rapid Thermal Annealing) at a temperature ranging 400 ∼ 1100 deg. C for 30 seconds, causing reaction between the excessive tungsten atoms in the first tungsten silicide layer 42 and the doped first, and second polysilicon layers 41 and 43 leading to form a second tungsten silicide layer of tetragonal phase. This tetragonal phase second tungsten silicide layer shows, not only a lower resistivity than the conventional one, but also better properties than ones formed by the first and second embodiments. That is, the diffusion of silicon atoms from the underlying polysilicon layer to the overlying first tungsten silicide layer during the heat treatment in the first and second embodiments, causing grain sizes in the first tungsten silicide layer to become greater, may make the second tungsten silicide layer bent. However, in the third embodiment, as the silicon atoms are fed to the first tungsten silicide layer from all of the first, and second polysilicon layers during the heat treatment, there is no possibility of bent. Alike the first, and second embodiments, metals and dopants may also be varied in this third embodiment.
[0026] Analysis data on test results of the semiconductor device of the present invention formed according to the aforementioned methods will be explained with reference to the attached drawings. Fig. 6 illustrates a graph showing a PH3 flow rate vs. a resistivity of a tungsten silicide layer(WSix) in deposition of a polysilicon layer according to the method for fabricating a semiconductor device of the present invention, Fig. 7 illustrates a graph showing a sputtering time vs. a silicon atoms/tungsten atoms ratio in a tungsten silicide layer(WSix) for different PH3 flow rates in deposition of a polysilicon layer according to the present invention. Fig. 8 illustrates a graph showing a deposition temperature of a tungsten silicide layer (WSix) vs a composition of the tungsten silicide layer of the present invention and Fig. 9 illustrates a graph showing a reaction temperature of a tungsten silicide layer formed according to different source gases injected into a doped polysilicon layer of the present invention vs. formation energy.
[0027] First, changes in resistivity and thickness of a tungsten silicide layer according to a change of a flow rate of PH3 gas in deposition of a polysilicon layer will be discussed.
[0028] Referring to Fig. 6, in doping the polysilicon layer, as a concentration of phosphorus(P) is increased, i.e., the PH3 flow rate is increased, a thickness of the tungsten silicide layer(i.e., a deposition rate) is decreased and the resistivity of the tungsten silicide layer is substantially lowered compared to a conventional case. For example, the resistivity is 905 µΩ·cm when no PH3 gas presents, and the resistivities are 412 µΩ·cm and 310 µΩ·cm when the PH3 flow rates are 120 sccm and 240 sccm, respectively.
[0029] Next, a change in a composition ratio of silicon atoms vs. tungsten atoms according to a change of a PH3 flow rate in deposition of the polysilicon layer will be discussed. An AES(Auger Electron Spectroscopy) analysis result of the conditions in which a tungsten excess tungsten silicide(WSix) layer is formed at an interface between a doped polysilicon layer and a tungsten silicide layer in formation of the tungsten silicide layer by depositing tungsten on the doped polysilicon layer will be explained.
[0030] Referring to Fig. 7, as PH3 is added to a polysilicon layer, increasing a dopant concentration in the polysilicon layer, a tungsten excess layer was appeared at an interface between the tungsten silicide layer and the polysilicon layer; a tungsten silicide layer containing the more tungsten atoms is formed when the PH3 flow rate is the lower if the sputter durations are the same. For example, the tungsten silicide layer contains mare tungsten atoms when the PH3 flow rate is 60 sccm than 240 sccm. The composition ratio of silicon atoms to tungsten atoms right after deposition of the tungsten silicide layer is made to be 0.5 ∼ 2.
[0031] A composition change of a tungsten silicide layer according to a deposition temperature change of the tungsten silicide layer will be discussed Fig 8 illustrates an XRD(X-ray diffraction) analysis result of tungsten silicide layers(WSix) deposited at different temperatures while other conditions was kept the same.
[0032] Referring to Fig. 8, when the tungsten silicide layers were deposited at different temperatures of 510 deg. C, 525 deg. C, 540 deg. C, 555 deg. C, 570 deg. C, 585 deg. C and 600 deg. C respectively, the tungsten silicide layers deposited at temperatures below 555 deg. C were at amorphous phase and the tungsten silicide layers deposited at temperatures above 555 deg. C were at a phase in which amorphous and crystalline tungsten silicides exist together. And, from the fact that X-rays appear intensive when 2Θ(angle) of the tungsten silicide layer are 30 deg. and approx. 40 deg., it can be known that the X-rays are diffracted at those angles where the tungsten silicide layer has a crystal orientation of (111).
[0033] Further, the reason why the tungsten silicide layer of the present invention has better resistivity and step coverage will be explained in thermodynamic point of view with reference to Fig. 8. Fig. 9 illustrates a reaction temperature vs. a formation energy(ΔG) in case a tungsten silicide layer is formed by a reaction of a doped polysilicon layer with WF6 gas and SiH2Cl2 gas.
[0035] And, a reaction equation in formation of the tungsten silicide layer (WSi2) is as shown below.
[0036] In the method for forming a tungsten silicide of the present invention since the reaction (equation 1) of forming tungsten and PF5 takes place before the reaction(equation 2) of forming the tungsten silicide, the tungsten excess tungsten silicide layer(WSix) is formed at the end. In this instance, formation enthalpies(ΔHf) of WSi2, PF5 and WF6 are -31.0, -265.73 and 62.48 [kJ/gram. atom], respectively. Because the formation enthalpy of PF5 is substantially stable compared to that of WSi2 or WF6, PF5 is produced in advance. And, as a result of the experiment, it is also found that tungsten is also formed from a reaction caused by phosphorus atoms(P) in the natural oxide film(P2O5) produced on the surface of the doped polysilicon layer when the doped polysilicon layer is exposed to the atmosphere, that is one reason of the tungsten excess tungsten silicide layer formation. The tungsten excess tungsten silicide layer is also formed in a process which involves a polysilicon layer doped with boron(B) or arsenic(As); BF3 and AsF3 are produced on the polysilicon layer doped with boron(B) or arsenic(As) as reaction by-products, of which formation enthalpies being -279.97 and -196.44[kJ/gram.atom], respectively. Because tungsten is produced before the tungsten silicide layer by the formation enthalpies, the tungsten excess tungsten silicide layer is formed. And, according to such a thermodynamic principle, a polycide layer can also be formed even using titanium(Ti) or tantalum(Ta) besides tungsten. In case of titanium, TiSi2 can be formed using TiCl4, TiI2, SiH4, SiH2Cl2 or the like as a source gas, and, in case of tantalum, TaSi2 can be formed using TaCl5, SiH4, SiH2Cl2 or the like as a source gas.
[0037] The method for forming a semiconductor device of the present invention as explained has the following advantages.
[0038] First, the tungsten excess tungsten silicide layer and the silicon nitride film formed in the heat treatment process(especially, in a RTA in an NH3 ambient) after formation of the tungsten silicide layer reduces a resistivity of the tungsten silicide layer, which subsequently improves device performance.
[0039] Second the doping of the polysilicon layer with phosphorus(P) boron(B), or arsenic(As), which have great formation energies, causes tungsten produced in advance in formation of a tungsten silicide layer on the polysilicon layer due to their thermodynamical properties. Because of this, a tungsten excess tungsten silicide layer is formed, which leads to increase a thickness of the tungsten silicide layer stuffed in a contact hole as much as the device packing density becomes greater, that improves a step coverage.
[0040] Third, in the case when polysilicon layers are formed on upper and under sides of the tungsten silicide layer, a tungsten silicide layer that is more flat can be obtained, and, diffusion of impurities, such as oxygen, into inner portion of the tungsten silicide layer can be prevented completely during conservation in the atmosphere before heat treatment after deposition of the second polysilicon, that allows conservation of the tungsten silicide layer properties.
[0041] It will be apparent to those skilled in the art that various modifications and variations can be made in the method for fabricating a semiconductor device of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
1. A method tor fabricating a semiconductor device, comprising the steps of:
forming a doped silicon layer on a substrate; and
forming a silicide layer containing excessive metal on the doped silicon layer.
2. A method as claimed in claim 1, wherein dopant of the doped silicon layer is boron(B),
phosphorus(P), or arsenic(As).
3. A method as claimed in claim 2, wherein the doped silicon layer is formed using a
source gas containing SiH4 and PH3 in a case when the dopant of the doped silicon layer is phosphorus(P).
4. A method as claimed in claim 1, wherein the metal excessively contained in the silicide
layer is one selected from tungsten(W), titanium(Ti), and tantalum(Ta).
5. A method as claimed in claim 4, wherein WF6 and SiH4 or WF6 and SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive tungsten.
6. A method as claimed in claim 4, wherein TiCl4 or TiI2 and SiH4 or SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive titanium(Ti).
7. A method as claimed in claim 4, wherein TaCl5 and SiH4 or SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive tantalum(Ta).
8. A method as claimed in claim 1, further comprising the step of heat treating the silicide
layer containing excessive metal.
9. A method as claimed in claim 8, wherein the heat treatment is conducted at a temperature
in a range of 400 deg. C ∼ 1100 deg. C.
10. A method as claimed in claim 8, wherein the heat treatment is conducted in a gaseous
ambient containing nitrogen atoms for forming a protective film on a surface of the
silicide layer containing excessive metal.
11. A method as claimed in claim 1, wherein the silicide layer is formed amorphous.
12. A method as claimed in claim 11, wherein the silicide layer is formed by depositing
the silicide layer at a temperature below 555 deg. C for making the silicide layer
amorphous.
13. A method as claimed in claim 1, wherein, in the step of forming a silicide layer coming
excessive metal on the doped silicon layer, the silicide layer is formed without breakage
of a vacuum for preventing exposure of the doped silicon layer to the atmosphere.
14. A method as claimed in claim 1, wherein the doped silicon layer is formed with polysilicon
layer.
15. A method as claimed in claim 1, wherein the silicide layer containing excessive metal
is formed such that a ratio of metal atoms(M) to silicon atoms(Si) satisfies a condition
of 0.5≤x<2 in MSix.
16. A method as claimed in claim 1, wherein the silicide layer is formed by chemical vapor
deposition.
17. A method for fabricating a semiconductor device, comprising the steps of
forming a doped silicon layer on a substrate; and,
forming a silicide layer containing excessive metal on the doped silicon layer, the silicide layer including amorphous phases and crystalline phases existing together.
18. A method as claimed in claim 17, wherein the silicide layer is formed by depositing
the silicide layer at a temple above 555 deg. C for forming the silicide layer containing
excessive metal and having amorphous phases and crystalline phases existing together.
19. A method as claimed in claim 17, further comprising the step of injecting ions into
the silicide layer containing excessive metal and having amorphous phases and crystalline
phases existing together, for converting the silicide layer of crystalline phase into
amorphous phase.
20. A method as claimed in claim 19, wherein the ions are of phosphorus(P), boron(B),
or arsenic(As).
21. A method as claimed in claim 20, the injection of ions is conducted to a dose of 1x1015 cm-3 at an ion injection energy of 45 ∼ 55 KeV in a case of phosphorus(P), 10 ∼ 20 KeV
in a case of boron(B), and 55 ∼ 65 KeV in a case of arsenic(As).
22. A method for fabricating a semiconductor device, comprising the steps of:
forming a doped first silicon layer on a semiconductor substrate;
forming a metal silicide layer containing excessive metal on the doped first silicon layer; and,
forming a second silicon layer on the metal silicide layer containing excessive metal.
23. A method as claimed in claim 22, wherein dopant of the doped first silicon layer is
boron(B), phosphorus(P), or arsenic(As).
24. A method as claimed in claim 23, wherein the doped first silicon layer is formed using
a source gas containing SiH4 and PH3 in a case when the dopant of the doped first silicon layer is phosphorus(P).
25. A method as claimed in claim 22, wherein the metal excessively contained in the silicide
layer is one selected from tungsten(W), titanium(Ti), and tantalum(Ta).
26. A method as claimed in claim 25, wherein WF6 and SiH4 or WF6 and SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive tungsten.
27. A method as claimed in claim 25, wherein TiCl4 or TiI2 and SiH4 or SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive titanium(Ti).
28. A method as claimed in claim 25, wherein TaCl5 and SiH4 or SiH2Cl2 are used as source gases for causing the silicide layer to contain excessive tantalum(Ta).
29. A method as claimed in claim 22, further comprising the step of heat treating the
silicide layer containing excessive metal.
30. A method as claimed in claim 29, wherein the heat treatment is conducted at a temperature
in a range of 400 deg. C ∼ 1100 deg. C.
31. A method as claimed in claim 30, wherein the heat treatment is conducted in a gaseous
ambient containing nitrogen atoms for forming a protective film on a surface of the
silicide layer containing excessive metal.
32. A method as claimed in claim 22, wherein the silicide layer is formed amorphous.
33. A method as claimed in claim 32, wherein the silicide layer is formed by depositing
the silicide layer at a temperature below 555 deg. C for making the silicide layer
amorphous.
34. A method as claimed in claim 22, wherein, in the step of forming a silicide layer
containing excessive metal on the doped first silicon layer, the silicide layer is
formed without breakage of a vacuum for preventing exposure of the doped first silicon
layer to the atmosphere.
35. A method as claimed in claim 22, wherein the first, and second silicon layers are
formed with polysilicon layers.
36. A method as claimed in claim 22, wherein the silicide layer containing excessive metal
is formed such that a ratio of metal atoms(M) to silicon atoms(Si) satisfies a condition
of 0.5≤x<2 in MSix.
37. A method as claimed in claim 22, wherein the silicide layer containing excessive metal
is formed such that amorphous phases and crystalline phases exist therein together.
38. A method as claimed in claim 37, wherein the silicide layer is formed by depositing
the silicide layer at a temperature above 555 deg. C for forming the silicide layer
containing excessive metal and having amorphous phases and crystalline phases existing
together.
39. A method for fabricating a semiconductor device, comprising the steps of:
forming an impurity doped silicon layer on a substrate; and,
causing the impurity in the impurity doped silicon layer and a fed source gas to make reaction to form a silicide layer on the impurity doped silicon layer.
40. A method as claimed in claim 39, wherein the fed source gas includes first gas and
second gas, whereas a silicide layer containing excessive metal is formed both by
a metal segregation reaction been the first gas and the impurity in the impurity doped
silicon layer and by a silicidation reaction between the first, and second gases.
41. A method as claimed in claim 39, wherein the impurity in the impurity doped silicon
layer is phosphorus(P), boron(B), or arsenic(As).
42. A method as claimed in claim 39, wherein the first gas is WF6, and the second gas is SiH4 or SiH2Cl2.