(19)
(11)
EP 0 909 461 A1
(12)
(43)
Date of publication:
21.04.1999
Bulletin 1999/16
(21)
Application number:
97915877.0
(22)
Date of filing:
07.03.1997
(51)
International Patent Classification (IPC):
H01L
21/
768
( . )
(86)
International application number:
PCT/US1997/003552
(87)
International publication number:
WO 1998/000863
(
08.01.1998
Gazette 1998/01)
(84)
Designated Contracting States:
DE FR GB NL
(30)
Priority:
01.07.1996
US 19960673005
(71)
Applicant:
ADVANCED MICRO DEVICES INC.
Sunnyvale, California 94088-3453 (US)
(72)
Inventor:
KEPLER, Nick
San Jose, CA 95129 (US)
(74)
Representative:
Sanders, Peter Colin Christopher
BROOKES & MARTIN High Holborn House 52/54 High Holborn
London WC1V 6SE
London WC1V 6SE (GB)
(54)
METHOD FOR SIMPLIFYING THE MANUFACTURE OF AN INTERLAYER DIELECTRIC STACK