(19)
(11) EP 0 909 461 A1

(12)

(43) Date of publication:
21.04.1999 Bulletin 1999/16

(21) Application number: 97915877.0

(22) Date of filing: 07.03.1997
(51) International Patent Classification (IPC): 
H01L 21/ 768( . )
(86) International application number:
PCT/US1997/003552
(87) International publication number:
WO 1998/000863 (08.01.1998 Gazette 1998/01)
(84) Designated Contracting States:
DE FR GB NL

(30) Priority: 01.07.1996 US 19960673005

(71) Applicant: ADVANCED MICRO DEVICES INC.
Sunnyvale, California 94088-3453 (US)

(72) Inventor:
  • KEPLER, Nick
    San Jose, CA 95129 (US)

(74) Representative: Sanders, Peter Colin Christopher 
BROOKES & MARTIN High Holborn House 52/54 High Holborn
London WC1V 6SE
London WC1V 6SE (GB)

   


(54) METHOD FOR SIMPLIFYING THE MANUFACTURE OF AN INTERLAYER DIELECTRIC STACK