Electronic component unit, electronic assembly using the unit, and method for manufacturing the electronic component unit

(19)

(11)

EP 0 917 191 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	24.05.2000 Bulletin 2000/21

(43)	Date of publication A2:
	19.05.1999 Bulletin 1999/20

(21)	Application number: 98121864.7

(22)	Date of filing: 17.11.1998

(51)	International Patent Classification (IPC)⁷: H01L 21/60, H01L 21/56

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

18.11.1997 JP 31676797
30.03.1998 JP 8336598

(71)	Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
	Kadoma-shi, Osaka 571-0000 (JP)

(72)	Inventors:
	Oishi, Junji Osaka 590-0504 (JP) Nagai, Kenichi Soraku-gun, Kyoto 619-1127 (JP)

(74)	Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
	Maximilianstrasse 58 80538 München 80538 München (DE)

(54)	Electronic component unit, electronic assembly using the unit, and method for manufacturing the electronic component unit

(57) In an electronic component unit, in order to prevent the occurrence of connection trouble between the connecting area of a conductive pattern and the electrode of an electronic component, the surface of connecting area 4a of conductive pattern 4 formed on substrate 1 is roughened, and the protruding electrode 7a of a semiconductor integrated circuit 7 is connected with the roughened surface of connecting area 4a by means of an electroconductive adhesive 8.

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