(19)
(11) EP 0 932 913 A1

(12)

(43) Date of publication:
04.08.1999 Bulletin 1999/31

(21) Application number: 96944775.0

(22) Date of filing: 16.12.1996
(51) International Patent Classification (IPC): 
C25D 7/ 12( . )
H01L 21/ 288( . )
H01L 23/ 532( . )
H01L 21/ 28( . )
H01L 21/ 768( . )
(86) International application number:
PCT/US1996/019592
(87) International publication number:
WO 1998/027585 (25.06.1998 Gazette 1998/25)
(84) Designated Contracting States:
DE FR GB IE IT

(71) Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Armonk, NY 10504 (US)

(72) Inventors:
  • ANDRICACOS, Panayotis, Constantinou
    Croton-on-Hudson, NY 10520 (US)
  • DELIGIANNI, Hariklia
    Edgewater, NJ 07020 (US)
  • DUKOVIC, John, Owen
    Pleasantville, NY 10570 (US)
  • HORKANS, Wilma, Jean
    Ossining, NY 10562 (US)
  • UZOH, Cyprian, Emeka
    Hopewell Junction, NY 12533 (US)
  • WONG, Kwong, Hon
    Wappingers Falls, NY 12590 (US)
  • HU, Chao-Kun
    Somers, NY 10589 (US)
  • EDELSTEIN, Daniel, Charles
    New Rochelle, NY 10801 (US)
  • RODBELL, Kenneth, Parker
    Poughquag, NY 12570 (US)
  • HURD, Jeffery, Louis
    Marlboro, NY 12542 (US)

(74) Representative: Ling, Christopher John 
IBM United Kingdom Limited, Intellectual Property Department, Hursley Park
Winchester, Hampshire SO21 2JN
Winchester, Hampshire SO21 2JN (GB)

   


(54) ELECTROPLATED INTERCONNECTION STRUCTURES ON INTEGRATED CIRCUIT CHIPS