CERAMIC COMPOSITE WIRING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE - Patent 0948879

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EP 0 948 879 A1

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(43)	Date of publication:
	13.10.1999 Bulletin 1999/41

(21)	Application number: 97954258.0

(22)	Date of filing: 29.12.1997

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International Patent Classification (IPC):

H05K 7/ 20^{( . )}
H01L 23/ 367^{( . )}
H01L 23/ 498^{( . )}
H05K 1/ 02^{( . )}

H01L 21/ 48^{( . )}
H01L 23/ 373^{( . )}
H01L 23/ 64^{( . )}

(86)	International application number:
	PCT/US1997/023976

(87)	International publication number:
	WO 1998/030072 (09.07.1998 Gazette 1998/27)

(84)	Designated Contracting States:
	DE FR GB IE

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Priority:

30.12.1996 US 19960033983P

(71)	Applicant: DeRochemont, L. Pierre doing business as C2 Technologies
	Hampton, NH 03843-0057 (US)

(72)	Inventors:
	DEROCHEMONT, L., Pierre P.O. Box 57; Hampton, NH 03843-0057 (US) FARMER, Peter, H. Hampton, NH 03843-0057 (US)

(74)	Representative: Casey, Lindsay Joseph, et al
	F. R. Kelly & Co. 27 Clyde Road Ballsbridge Dublin 4 Dublin 4 (IE)

(54)	CERAMIC COMPOSITE WIRING STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE