METHOD FOR TRANSFER MOLDING STANDARD ELECTRONIC PACKAGES AND APPARATUS FORMED THEREBY - Patent 0954425

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EP 0 954 425 A1

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(43)	Date of publication:
	10.11.1999 Bulletin 1999/45

(21)	Application number: 97948154.0

(22)	Date of filing: 13.11.1997

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International Patent Classification (IPC):

B29C 45/ 14^{( . )}
H05K 13/ 00^{( . )}

H05K 5/ 02^{( . )}

(86)	International application number:
	PCT/US1997/019980

(87)	International publication number:
	WO 1999/025534 (27.05.1999 Gazette 1999/21)

(84)	Designated Contracting States:
	DE FR GB IT

(71)	Applicant: Hestia Technologies, Inc.
	Sunnyvale, CA 94089-1301 (US)

(72)	Inventor:
	WEBER, Patrick, O. San Jose, CA 95136 (US)

(74)	Representative: Signore, Robert, et al
	c/o SOCIETE DE PROTECTION DES INVENTIONS 3, rue du Dr. Lancereaux 75008 Paris 75008 Paris (FR)

(54)	METHOD FOR TRANSFER MOLDING STANDARD ELECTRONIC PACKAGES AND APPARATUS FORMED THEREBY