IMPROVED LEADFRAME STRUCTURE AND PROCESS FOR PACKAGING INTEGRATED CIRCUITS - Patent 0954878

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EP 0 954 878 A1

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(43)	Date of publication:
	10.11.1999 Bulletin 1999/45

(21)	Application number: 97945595.0

(22)	Date of filing: 04.11.1997

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International Patent Classification (IPC):

H01L 23/ 28^{( . )}
H01L 23/ 495^{( . )}

H01L 21/ 56^{( . )}
H01L 23/ 50^{( . )}

(86)	International application number:
	PCT/US1997/020028

(87)	International publication number:
	WO 1998/020552 (14.05.1998 Gazette 1998/19)

(84)	Designated Contracting States:
	AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

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Priority:

05.11.1996 US 19960744520

(71)	Applicant: GCB Technologies, LLC
	Saratoga, CA 95070 (US)

(72)	Inventors:
	BUCCI, Giuseppe, D. Monte Sereno, CA 95030 (US) VOISIN, Paul, H. San Mateo, CA 94402 (US)

(74)	Representative: Manitz, Finsterwald & Partner
	Postfach 22 16 11 80506 München 80506 München (DE)

(54)	IMPROVED LEADFRAME STRUCTURE AND PROCESS FOR PACKAGING INTEGRATED CIRCUITS