SOLDER ALLOY OR TIN CONTACT BUMP STRUCTURE FOR UNENCAPSULATED MICROCIRCUITS AS WELL AS A PROCESS FOR THE PRODUCTION THEREOF - Patent 0958606

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EP 0 958 606 A1

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(43)	Date of publication:
	24.11.1999 Bulletin 1999/47

(21)	Application number: 97924046.0

(22)	Date of filing: 30.05.1997

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International Patent Classification (IPC):

H01L 21/ 60^{( . )}

(86)	International application number:
	PCT/FI1997/000331

(87)	International publication number:
	WO 1997/045871 (04.12.1997 Gazette 1997/52)

(84)	Designated Contracting States:
	DE DK FI FR GB IE IT NL SE

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Priority:

31.05.1996 FI 19960002277

(71)	Applicant: Elcoteq Network OY
	08100 Lohja (FI)

(72)	Inventors:
	KIVILAHTI, Jorma FIN-02170 Espoo (FI) PALM, Petteri FIN-02100 Espoo (FI)

(74)	Representative: Lipsanen, Jari Seppo Einari, et al
	Seppo Laine Oy, Itämerenkatu 3 B 00180 Helsinki 00180 Helsinki (FI)

(54)	SOLDER ALLOY OR TIN CONTACT BUMP STRUCTURE FOR UNENCAPSULATED MICROCIRCUITS AS WELL AS A PROCESS FOR THE PRODUCTION THEREOF