Production method of electronic parts and water treatment apparatus

(19)

(11)

EP 0 959 491 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	11.05.2005 Bulletin 2005/19

(43)	Date of publication A2:
	24.11.1999 Bulletin 1999/47

(21)	Application number: 99303881.9

(22)	Date of filing: 19.05.1999

(51)	International Patent Classification (IPC)⁷: H01L 21/00

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

20.05.1998 JP 15530198

(71)	Applicant: TDK Corporation
	Chuo-ku, Tokyo 103-8272 (JP)

(72)	Inventors:
	Gotoh, Masashi Chuo-ku, Tokyo 103-8272 (JP) Kanazawa, Jitsuo Chuo-ku, Tokyo 103-8272 (JP) Yamamoto, Syuichiro Chuo-ku, Tokyo 103-8272 (JP)

(74)	Representative: Wise, Stephen James et al
	c/o RAWORTH MOSS & COOK, 36 Sydenham Road Croydon, Surrey CR0 2EF Croydon, Surrey CR0 2EF (GB)

(54)	Production method of electronic parts and water treatment apparatus

(57) A production method of an electronic part comprising a step of working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5 ≤ pH ≤ 6.5 and DO ≤ 0.5pH² - 6.5pH + 22 [wherein DO represents a dissolved oxygen amount (unit ppm)].
By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.

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