(19)
(11) EP 0 964 083 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
30.01.2002 Bulletin 2002/05

(43) Date of publication A2:
15.12.1999 Bulletin 1999/50

(21) Application number: 99202642.7

(22) Date of filing: 18.05.1995
(51) International Patent Classification (IPC)7C30B 25/02, C30B 25/14, C30B 25/12
(84) Designated Contracting States:
AT BE CH DE DK ES FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
LT LV SI

(30) Priority: 20.05.1994 JP 10676094

(62) Application number of the earlier application in accordance with Art. 76 EPC:
95303333.9 / 0683249

(71) Applicant: SHARP KABUSHIKI KAISHA
Osaka 545-8522 (JP)

(72) Inventors:
  • Ishizumi, Takashi
    Kitakatsuragi-gun, Nara-ken (JP)
  • Kaneiwa, Shinji
    Nara-shi, Nara-ken (JP)

(74) Representative: Suckling, Andrew Michael et al
Marks & Clerk 4220 Nash Court Oxford Business Park South
Oxford OX4 2RU
Oxford OX4 2RU (GB)

   


(54) Method and apparatus for growing a compound semiconductor layer


(57) A growth chamber (1) has a cylindrical portion (1b) and an end plate (1a) which closes an upstream end of the cylindrical portion (1b). The end plate (1a) is provided with a cation gas material supply inlet (2) and an anion material gas supply inlet (3), while an exhaust device is provided on the downstream side of the cylindrical portion (1b). A substrate holder (2) having a substrate support surface (20) is provided in the cylinder portion (1b). A gas separating member (6) separates flow paths of material gases from each other, thereby forming on the substrate support surface (20) a plurality of material gas supply areas. A drive device (7) rotates the substrate holder (5) with a substrate (4) set on the substrate support surface (20) thereof around the centre line of the cylindrical portion (1b). Then a cation material and an anion material gas are alternatively supplied to the surface of the substrate (4). In one embodiment, the substrate holding surface (40) of the substrate holder (25) has the configuration of an interior surface of a cylindrical prism having its centre line coincident with the centre line of the cylindrical portion (1b). In another embodiment, the method comprises supplying two or more cation gases, or two or more different anion gases, to the growth chamber (1) during one revolution of the substrate holder.










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