(19)
(11)
EP 0 968 081 A1
(12)
(43)
Date of publication:
05.01.2000
Bulletin 2000/01
(21)
Application number:
97937023.6
(22)
Date of filing:
06.08.1997
(51)
International Patent Classification (IPC)
7
:
B31F
1/22
(86)
International application number:
PCT/US9713/069
(87)
International publication number:
WO 9809/804
(
12.03.1998
Gazette 1998/10)
(84)
Designated Contracting States:
DE FR GB IT
(30)
Priority:
04.09.1996
US 711360
(71)
Applicant:
SIBOND, L.L.C.
St. Peters, MO 63376 (US)
(72)
Inventors:
IYER, Subramanian, S.
Mt. Kisco, NY 10549 (US)
DOWNEY, William, P.
St. Charles, MO 63304 (US)
(74)
Representative:
Eyles, Christopher Thomas et al
W.P. THOMPSON & CO.Celcon House289-293 High Holborn
London WC1V 7HU
London WC1V 7HU (GB)
(54)
FLATTENING PROCESS FOR BONDED SEMICONDUCTOR SUBSTRATES