(19)
(11) EP 0 968 081 A1

(12)

(43) Date of publication:
05.01.2000 Bulletin 2000/01

(21) Application number: 97937023.6

(22) Date of filing: 06.08.1997
(51) International Patent Classification (IPC)7B31F 1/22
(86) International application number:
PCT/US9713/069
(87) International publication number:
WO 9809/804 (12.03.1998 Gazette 1998/10)
(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 04.09.1996 US 711360

(71) Applicant: SIBOND, L.L.C.
St. Peters, MO 63376 (US)

(72) Inventors:
  • IYER, Subramanian, S.
    Mt. Kisco, NY 10549 (US)
  • DOWNEY, William, P.
    St. Charles, MO 63304 (US)

(74) Representative: Eyles, Christopher Thomas et al
W.P. THOMPSON & CO.Celcon House289-293 High Holborn
London WC1V 7HU
London WC1V 7HU (GB)

   


(54) FLATTENING PROCESS FOR BONDED SEMICONDUCTOR SUBSTRATES