Detailed Description of the Invention
Technical Field of the Invention
[0001] This invention relates to a method for forming a continuous material by connecting
sheet materials and an apparatus for forming a continuous material by connecting sheet
materials which is used for carrying out the method. More particularly, it relates
to a method for forming a continuous material by connecting sheet materials which
are used in various fields including the processing of metal foils, the processing
of metal-plastic composite film materials, and the processing of heat-resistant resin
films such as polyimides and which require high-temperature processing in the range
of 200°C to less than 550°C by means of coating and drying equipment, heat-treating
equipment or the like, as well as an apparatus for forming a continuous material by
connecting sheet materials which is used for carrying out the method.
Prior Art
[0002] Conventionally, ultrasonic welding has been employed as a method for connecting metal
foils with each other. Moreover, connecting methods using or staples have been employed
to connect heat-resistant plastics, such as polyimides, with each other.
[0003] Ultrasonic welding can be used to connect different metal foils, but cannot be used
to connect heat-resistant plastics such as polyimides. On the other hand, the connecting
method using a heat-resistant adhesive tape can be employed in a temperature range
of less than 200°C, but shows a reduction in adhesion strength when it is employed
at temperatures higher than 200°C. Consequently, the joint may be separated when a
tension of 0.1 to 50 kgf/cm is applied to the material. Moreover, the connecting method
using staples fails to give sufficient bonding strength when it is employed for thin
metal foils, plastic films and other materials having a thickness of not greater than
18 mm. Consequently, this method is not satisfactory in that the material may be broken
when a tension of 0.1 to 50 kgf/cm is applied thereto.
Problem to Be Solved by the Invention
[0004] In view of the above-described disadvantages of the prior art, an object of the present
invention is to provide a method for forming a continuous material by connecting sheet
materials wherein a metal foil and a heat-resistant plastic can be satisfactorily
connected together, to say nothing of metal foils or heat-resistant plastics, and
wherein the connected materials will not be separated even where they are processed
at a temperature in the range of 200°C to less than 550°C and under a tension in the
range of 0.1 to 50 kgf/cm, as well as an apparatus for forming a continuous material
which is used for carrying out the aforesaid method.
Means for Solving the Problem
[0005] In order to solve the above-described problem, the present inventors made intensive
investigations and have now found a method in which, using a connecting apparatus
comprising a hot press, a material locking device and an accumulator, a continuous
material can be formed by interposing a resin bonding layer between the trailing edge
of a sheet material and the leading edge of another sheet material, and subjecting
this part to thermocompression bonding. During thermocompression bonding, the material
locking device is operated so that the part to be joined by thermocompression bonding
comes to a standstill within the hot press, and the accumulator is also operated so
that the feed speed of the sheet material on the downstream side is adjusted to a
predetermined value. Thus, the completely connected sheet materials can be processed
continuously. The present invention has been completed on the basis of these findings.
[0006] That is, the present invention provides a method for forming a continuous material
by connecting a preceding sheet material with a succeeding other sheet material in
end-to-end relationship while feeding them in their longitudinal direction, the method
comprising the steps of:
(1) interposing a resin bonding layer 5 between the trailing edge of the preceding
sheet material 4 and the leading edge of the succeeding other sheet material 6, and
temporarily joining them together;
(2) after the preceding sheet material 4 and the succeeding other sheet material 6
are fed until the temporarily joined part reaches a hot press 1, operating a material
locking device 2 to lock a part of the preceding sheet material 4 and thereby bring
the temporarily joined part to a standstill within the hot press 1, and also operating
an accumulator 3 to keep the feed speed of the preceding sheet material 4 constant
on the downstream side thereof;
(3) operating the hot press 1 to effect thermocompression bonding of the temporarily
joined part and thereby connect the preceding sheet material 4 with the succeeding
other sheet material 6; and
(4) releasing the preceding sheet material 4 from the lock by the material locking
device 2 and feeding the connected sheet materials downstream through the accumulator
3.
[0007] Preferred embodiments of the above-described method for forming a continuous material
by connecting sheet materials in accordance with the present invention include a method
for forming a continuous material by connecting sheet materials as described above
wherein the thermocompression bonding is performed at a temperature in the range of
200°C to less than 550°C and a pressure in the range of 0.001 to 50 kgf/cm
2; a method for forming a continuous material by connecting sheet materials as described
above wherein the trailing edge of the preceding sheet material 4 and the leading
edge of the succeeding other sheet material 6 each have a length of 10 to 1,000 mm;
a method for forming a continuous material by connecting sheet materials as described
above wherein the preceding sheet material 4 and the succeeding other sheet material
6 each comprise a metal foil or heat-resistant resin film having a thickness of 5
to 500 µm; and a method for forming a continuous material by connecting sheet materials
as described above wherein the resin bonding layer has a thickness of 0.1 to 50 µm.
Each of the above-described methods for forming a continuous material by connecting
sheet materials is preferably employed especially where the connected sheet materials
are continuously processed at a temperature in the range of 200 °C to less than 550°C
and under a tension in the range of 0.1 to 50 kgf/cm.
[0008] In another aspect, the present invention also provides an apparatus for forming a
continuous material by connecting sheet materials which is used for carrying out each
of the above-described methods for forming a continuous material by connecting sheet
materials, the apparatus comprising a hot press for effecting thermocompression bonding
of a temporarily joined part formed by making the trailing edge of a preceding sheet
material and the leading edge of a succeeding other sheet material overlap with a
bonding layer interposed therebetween, and temporarily joining them together; a material
locking device for locking a part of the preceding sheet material in order to bring
the temporarily joined part to a standstill within the hot press; and an accumulator
for keeping the traveling speed of the preceding material constant on the downstream
side of the material locking device.
[0009] According to the present invention, even where a subsequent processing step is carried
out under severe conditions including a temperature in the range of 200°C to less
than 550°C and a tension in the range of 0.1 to 50 kgf/cm, sheet materials can be
satisfactorily processed without suffering from breakage, separation, meandering,
variation in tension, or the like. Moreover, by connecting sheet materials according
to the present invention, they can be stably and efficiently connected with each other,
and they can be fed to a subsequent step at a constant feed speed.
Embodiments of the Invention
[0010] The present invention is more specifically described hereinbelow.
[0011] An outline of the method for forming a continuous material by connecting sheet materials
in accordance with the present invention is as follows. First of all, while a preceding
sheet material is being fed by a feeding means, the trailing edge of the preceding
sheet material and the leading edge of a succeeding other sheet material are made
to overlap with a resin bonding layer interposed therebetween, and temporarily joined
together by means of an adhesive tape or the like. The temporarily joined sheet materials
are fed downstream by the feeding means. As soon as the temporarily joined part reaches
a hot press, a part of the preceding sheet material is locked by means of a sheet
material locking device, so that the temporarily joined part comes to a standstill
within the hot press. At this time, an accumulator is operated to keep the feed speed
of the preceding sheet material constant. Subsequently, the hot press is operated
to effect thermocompression bonding of the temporarily joined part of the sheet materials
having the resin bonding layer therebetween. After the connection of the sheet materials
is completed, the material locking device unlocks the preceding sheet material, so
that the sheet materials connected by the resulting joint travel toward the accumulator.
[0012] Now, one embodiment of the present invention is described below with reference to
the accompanying drawings.
[0013] FIGs. 1 to 4 are given for the purpose of explaining the construction and operation
of one form of apparatus used for carrying out the method for forming a continuous
material by connecting sheet materials in accordance with the present invention. Specifically,
FIG. 1 illustrates sheet materials having a resin bonding layer interposed therebetween.
FIG. 2 illustrates the sheet materials whose joined part has come to a standstill
within a hot press. FIG. 3 illustrates the sheet materials being subjected to thermocompression
bonding by operating the hot press. FIG. 4 illustrates the completely connected sheet
materials.
[0014] As illustrated in FIGs. 1 to 4, this form of apparatus includes a hot press 1 in
order to connect the trailing edge of a preceding sheet material 4 being fed by a
feeding means (not shown) and being processed, with the leading edge of a succeeding
other sheet material 6 to be processed, by means of a resin bonding layer 5.
[0015] No particular limitation is placed on the type of the hot press 1. However, it is
preferable to use a hot press having hot platens in which a heater and the like are
incorporated. Although the heating temperature employed for thermocompression bonding
may be chosen according to the type of the resin bonding layer, it is usually in the
range of 200°C to less than 550°C and preferably in the range of 200 to 450°C. Although
no particular limitation is placed on the pressure employed for hot pressing, it is
preferably in the range of 0.001 to 50 kgf/cm
2 and more preferably in the range of 0.001 to 1 kgf/cm
2 so that a sufficient adhesion strength may be achieved and no damage may be caused
to the sheet materials.
[0016] In order to transfer heat and pressure uniformly, it is preferable to cover the hot
platens with heat-resistant rubber. Alternatively, it is also preferable to provide
the hot platens with a raised pattern and thereby increase the applied pressure locally.
No particular limitation is placed on the time required for hot pressing. However,
from a practical point of view, it ranges from 0.1 second to 30 minutes, preferably
from 0.5 second to 10 minutes, and more preferably from 1 second to 5 minutes. No
particular limitation is placed on the length of the part in which the sheet materials
are connected by thermocompression bonding. However, with consideration for the tension
applied to the sheet material being processed in a subsequent step, and the like,
it is usually in the range of about 10 to 1,000 mm and preferably in the range of
50 to 500 mm.
[0017] Moreover, this apparatus includes a material locking device 2 for stopping the movement
of the trailing edge of the preceding sheet material 4 being processed, during bonding
by the hot press 1; and an accumulator 3 for keeping the traveling speed of the preceding
sheet material 4 being processed constant on the downstream side of the material locking
device 2 (i.e., on the side of the material locking device 2 which is opposite to
the hot press 1).
[0018] The material locking device 2 preferably consists of a pair of rolls which can be
engaged with each other to pinch and lock the sheet material. The accumulator 3 preferably
consists of a plurality of rolls arranged in such a way that the length of the sheet
material wound around the rolls is regulated, for example, by shifting the opposed
rolls in a direction orthogonal to the feed direction of the sheet material, whereby
the traveling speed of the sheet material 4 being processed can be kept constant even
when it is locked by the material locking device 2.
[0019] The sheet materials which can be used as the sheet materials 4 and 6 include metal
foils such as copper foil, stainless foil, aluminum foil, Ni-Fe alloy foil, and copper-based
alloy foil; heat-resistant plastic films such as polyimides, polyamides, aramids and
liquid crystal polymers; and composite films composed of metal foils and heat-resistant
plastics. The thickness of the sheet materials is preferably in the range of about
5 to 500 µm, more preferably about 5 to 100 µm, and most preferably about 5 to 50
µm.
[0020] The resin bonding layer 5 used as the bonding layer may comprise any resin layer
characterized by thermoplasticity. A non-thermoplastic polyimide film, a metal foil
as described above, and other films having a resin boding layer formed on either side
thereof may also be used. In any case, the resin bonding layer constituting the bonding
layer has a thickness of about 0.1 to 100 µm.
[0021] A thermoplastic resin preferably having a glass transition temperature of 150 to
350°C is used for the resin boding layer, and examples thereof include thermoplastic
polyimides, aromatic polyamide-imides, aromatic polyetherimides and silicone-modified
polyimides. Especially preferred are thermoplastic polyimides.
[0022] As the thermoplastic polyimide forming the thermoplastic polyimide film used as the
bonding layer, there may be used well-known thermoplastic polyimides synthesized from
a diamine and a tetracarboxylic acid dianhydride. More specifically, the diamine may
preferably comprise at least one diamine selected from 1,3-bis(3-aminophenoxy) benzene,
4,4'-bis(3-aminophenoxy)biphenyl and 3,3'-diaminobenzophenone.
[0023] The tetracarboxylic acid dianhydride may preferably comprise at least one tetracarboxylic
acid dianhydride selected from 3,3',4,4'-(diphenyl ether)tetracarboxylic acid dianhydride,
3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, pyromellitic acid dianhydride
and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride.
[0024] The thermoplastic polyimide film used in the present invention preferably comprises
a film of a polycondensation polymer prepared from at least one diamine component
selected from the above-enumerated diamines and at least one tetracarboxylic acid
dianhydride component selected from the above-enumerated tetracarboxylic acid dianhydrides.
The molar ratio in which the diamine components is reacted with the tetracarboxylic
acid dianhydride component is usually such that the amount of tetracarboxylic acid
dianhydride component used is in the range of 0.75 to 1.25 moles per mole of the diamine
component. Preferably, the amount of tetracarboxylic acid dianhydride component used
is in the range of 0.8 to 1.2 moles.
[0025] A portion of the aforesaid diamine may be replaced by other diamines. The amine compounds
which can be used for substitutional purposes include, for example, m-phenylenediamine,
o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis(3-aminophenyl)
sulfide, (3-aminophenyl) (4-aminophenyl) sulfide, bis(4-aminophenyl) sulfide, bis(3-aminophenyl)
sulfoxide, (3-aminophenyl) (4-aminophenyl) sulfoxide, bis(3-aminophenyl) sulfone,
(3-aminophenyl) (4-aminophenyl) sulfone, bis(4-aminophenyl) sulfone, 3,4'-diaminobenzophenone,
4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane,
4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether,
3,4'-diaminodiphenyl ether, bis[4-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane,
1,1-bis[4-(3-aminophenoxy)phenyl]ethane, 1,1-bis[4-(4-aminophenoxy)phenyl]ethane,
1,2-bis[4-(3-aminophenoxy)phenyl]ethane, 1,2-bis[4-(4-aminophenoxy)phenyl]ethane,
2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane,
2,2-bis[4-(3-aminophenoxy)phenyl]butane, 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,
2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene,
1,4-bis(3-aminophenoxy)benzene, 1,4'-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyi,
bis[4-(3-aminophenoxy)phenyl] ketone, bis[4-(4-aminophenoxy)phenyl] ketone, bis[4-(3-aminophenoxy)phenyl]
sulfide, bis[4-(4-aminophenoxy)phenyl] sulfide, bis[4-(3-aminophenoxy)phenyl] sulfoxide,
bis[4-(aminophenoxy)phenyl] sulfoxide, bis[4-(3-aminophenoxy)phenyl] sulfone, bis[4-(4-aminophenoxy)phenyl]
sulfone, bis[4-(3-aminophenoxy)phenyl] ether, bis[4-(4-aminophenoxy)phenyl] ether,
1,4-bis[4-(3-aminophenoxy)benzoyl]benzene, 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene,
4,4'-bis[3-(4-aminophenoxy)benzoyl]diphenyl ether, 4,4'-bis[3-(3-aminophenoxy)benzoyl]diphenyl
ether, 4,4'-bis[4-(4-amino-α, α-dimethylbenzyl)phenoxy]benzophenone, 4,4'-bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]diphenyl
sulfone, bis[4-{4-(4-aminophenoxy)phenoxy}phenyl] sulfone, 1,4-bis[4-(4-aminophenoxy)-α,α-dimethylbenzyl]benzene
and 1,3-bis[4-(4-aminophenoxy)-α,α-dimethylbenzyl]benzene.
[0026] These amine compounds may be used alone or in admixture of two or more. The proportion
of the aforesaid specific diamine which may be replaced by other amine compounds is
usually in the range of 0 to 50 mole % of the diamine.
[0027] The aforesaid tetracarboxylic acid dianhydride may be used in combination with other
tetracarboxylic acid dianhydrides. The tetracarboxylic acid dianhydrides which can
be used for this purpose include, for example, ethylenetetracarboxylic acid dianhydride,
butanetetracarboxylic acid dianhydride, cyclopentanecarboxylic acid dianhydride, pyromellitic
acid dianhydride, 2,2',3,3'-benzophenonetetracarboxylic acid dianhydride, 2,2',3,3'-biphenyltetracarboxylic
acid dianhydride, 2,2-bis(3,4-dicarboxyphenyl) propane dianhydride, bis(3,4-dicarboxyphenyl)
ether dianhydride, bis(2,3-dicarboxyphenyl) ether dianhydride, bis(3,4-dicarboxyphenyl)
sulfone dianhydride, 1,1-bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane
dianhydride, 4,4'-(p-phenylenedioxy)diphthalic acid dianhydride, 4,4'-(m-phenylenedioxy)diphthalic
acid dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 1,4,5,8-naphthalenetetracarboxylic
acid dianhydride, 1,2,3,4-benzenetetracarboxylic acid dianhydride, 3,4,9,10-perylenetetracarboxylic
acid dianhydride, 2,3,6,7-anthracenetetracarboxylic acid dianhydride and 1,2,7,8-phenanthrenetetracarboxylic
acid dianhydride.
[0028] These tetracarboxylic acid dianhydrides may be used alone or in admixture of two
or more. The proportion of the aforesaid specific tetracarboxylic acid dianhydride
which may be replaced is usually in the range of 0 to 50 mole % of the tetracarboxylic
acid dianhydride.
[0029] In the present invention, a dicarboxylic acid anhydride may be added in order to
cap the chain ends of the thermoplastic polyimide used as a raw material for the formation
of a thermoplastic polyimide film. The dicarboxylic acid anhydrides which can be used
for this purpose include phthalic anhydride, 2,3-benzophenonedicarboxylic acid anhydride,
3,4-benzophenonedicarboxylic acid anhydride, 2,3-dicarboxyphenyl phenyl ether anhydride,
2,3-biphenyldicarboxylic acid anhydride, 3,4-biphenyldicarboxylic acid anhydride,
2,3-dicarboxyphenyl phenyl sulfone anhydride, 3,4-dicarboxyphenyl phenyl sulfone anhydride,
2,3-dicarboxyphenyl phenyl sulfide anhydride, 1,2-naphthalenedicarboxylic acid anhydride,
2,3-naphthalenedicarboxylic acid anhydride, 1,8-naphthalenedicarboxylic acid anhydride,
1,2-anthracenedicarboxylic acid anhydride, 2,3-anthracenedicarboxylic acid anhydride
and 1,9-anthracenedicarboxylic acid anhydride.
[0030] These dicarboxylic acid anhydrides may be substituted by groups having no reactivity
with amines or dicarboxylic acid anhydrides. The amount of dicarboxylic acid anhydride
added is usually in the range of 0.001 to 0.5 mole per 100 moles of the combined amount
of the aforesaid specific diamine and tetracarboxylic acid anhydride used as chief
raw materials. Preferably, it is in the range of 0.005 to 0.25 mole.
[0031] Similarly, a monoamine may be added in order to cap the chain ends of the thermoplastic
polyimide. The monoamines which can be used for this purpose include aniline, o-toluidine,
m-toluidine, p-toluidine, 2,3-xylidine, 2,4-xylidine, 2,5-xylidine, 2,6-xylidine,
3,4-xylidine, 3,5-xylidine, o-chloroaniline, m-chloroaniline, p-chloroaniline, o-nitroaniline,
o-bromoaniline, m-bromoaniline, o-nitroaniline, m-nitroaniline, p-nitroaniline, o-aminophenol,
m-aminophenol, p-aminophenol, o-anisidine, m-anisidine, p-anisidine, o-phenetidine,
m-phenetidine, p-phenetidine, o-aminobenzaldehyde, m-aminobenzaldehyde, p-aminobenzaldehyde,
o-aminobenzonitrile, m-aminobenzonitrile, p-aminobenzonitrile, 2-aminobiphenyl, 3-aminobiphenyl,
4-aminobiphenyl, 2-aminophenol phenyl ether, 3-aminophenol phenyl ether, 4-aminophenol
phenyl ether, 2-aminobenzophenone, 3-aminobenzophenone, 4-aminobenzophenone, 2-aminophenol
phenyl sulfide, 3-aminophenol phenyl sulfide, 4-aminophenol phenyl sulfide, 2-aminophenol
phenyl sulfone, 3-aminophenol phenyl sulfone, 4-aminophenol phenyl sulfone, α-naphthylamine,
β-naphthylamine, 1-amino-2-naphthol, 2-amino-1-naphthol, 4-amino-1-naphthol, 5-amino-1-naphthol,
2-amino-1-naphthol, 5-amino-2-naphthol, 7-amino-2-naphthol, 8-amino-2-naphthol, 1-aminoanthracene,
2-aminoanthracene and 9-aminoanthracene.
[0032] These monoamines may be used alone or in admixture of two or more. The amount of
monoamine added is usually in the range of 0.001 to 0.5 mole per 100 moles of the
combined amount of the aforesaid specific diamine and tetracarboxylic acid anhydride
used as chief raw materials. Preferably, it is in the range of 0.005 to 0.25 mole.
[0033] Beside the above-described thermoplastic polyimides, aromatic polyetherimides, aromatic
polyamide-imides, silicone-modified polyimides and the like may also be used for the
resin bonding layer in the method of the present invention.
[0034] Aromatic polyetherimides are polymers having ether linkages and imide linkages as
essential bonding units, and consist essentially of repeating units of the following
general formula (1).

[0036] These aromatic polyetherimides are commercially available from General Electric Company,
U.S.A., under the trade names of Ultem-1000, Ultem-4000, Ultem-6000 and the like.
[0037] Aromatic polyamide-imides are polymers having imide and amide linkages in the repeating
units of the main chain, and consist of repeating units represented b the following
general formula (9).

wherein Ar is a trivalent aromatic group containing at least one benzene ring, and
Z is a divalent organic group.
[0038] The especially preferred aromatic polyamide-imides which can be used in the present
invention are aromatic polyamide-imides having repeating units represented by the
following general formula (10) or (11).

[0039] These aromatic polyamide-imides are commercially available from AMOCO, U.S.A., under
the trade name of TORLON.
[0040] The silicone-modified polyimides which can be used in the method of the present invention
are polycondensation polymers prepared from a diamine containing a siliconediamine
as an essential component, and a tetracarboxylic acid dianhydride. Typical siliconediamines
are a,w-bisaminopolydimethylsiloxanes of the following general formula (12).

In formula (12), n preferably has a value of 0 to 10. It is especially preferable
to use a polymer in which n is 4 to 10, or a mixture of such a polymer and a monomer
in which n is 0.
[0041] The siliconediamine content in the total amine is preferably in the range of 5 to
15 mole %. At siliconediamine contents of 5 mole % or greater, the resulting polymer
desirably has low water-absorbing properties. At siliconediamine contents of 50 mole
% or less, the resulting polymer desirably has a high glass transition temperature
and hence good heat resistance. The diamines other than siliconediamines, which can
be used for the preparation of silicone-modified polyimides, include the same diamines
as can be used as raw materials for the preparation of thermoplastic polyimides. The
tetracarboxylic acid dianhydrides which can be used for this purpose include those
described previously.
[0042] Now, the operation of this form of apparatus for connecting sheet materials is explained
with reference to FIGs. 1 to 4. First of all, as illustrated in FIG. 1, a preceding
sheet material 4 being processed is fed through a hot press 1 by a feeding means (not
shown). Before passing through the hot press 1, the trailing edge of the preceding
sheet material 4 and the leading edge of a succeeding other sheet material 6 to be
processed are made to overlap with a resin bonding layer 5 interposed therebetween,
and temporarily joined together by means of an adhesive tape 7. This adhesive tape
7 may comprise a commercially available double-coated adhesive tape. In this step,
the hot press 1, a material locking device 2 and an accumulator 3 are not operated.
[0043] Next, as illustrated in FIG. 2, the trailing edge of the sheet material 4 and the
leading edge of the sheet material 6 are fed in the temporarily joined state. As soon
as the temporarily joined part reaches the hot press 1, a part of the sheet material
4 being processed is locked by means of a material locking device 2 installed between
the hot press 1 and an accumulator 3, so that the temporarily joined part comes to
a standstill within the hot press 1. At this time, the accumulator 3 is operated to
keep the traveling rate of the sheet material 4 being processed constant.
[0044] Moreover, as illustrated in FIG. 3, the hot press 1 is operated to effect thermocompression
bonding of the trailing edge of the sheet material 4 and the leading edge of the sheet
material 6 with the resin bonding layer 5 interposed therebetween.
[0045] After the connection of the sheet materials 4 and 6 by thermocompression bonding
is completed, the sheet material 4 is released from the lock by the material locking
device 2. Thus, as illustrated in FIG. 4, the joint between the sheet materials 4
and 6 travels toward accumulator 3.
[0046] As described above, the method and apparatus of this embodiment can connect the sheet
materials 4 and 6 stably and efficiently to form a continuous material. The connected
sheet materials 4 and 6 are processed in a subsequent step using coating and drying
equipment, heat-treating equipment, or other equipment, where it is exposed to a high
temperature in the range of 200°C to less than 550°C and a tension in the range of
0.1 to 50 kgf/cm. Even under such severe processing conditions, the connected sheet
materials can be satisfactorily processed without suffering from any trouble such
as breakage, meandering, or variation in tension.
Examples
[0047] Several embodiments of the present invention are more specifically explained with
reference to the following examples.
Example 1
[0048] In Example 1, there was employed a feeder for feeding sheet materials continuously
to a drying furnace having a temperature of 300°C. The sheet material being fed was
copper foil and its thickness was 18 µm. The sheet material to be processed next time
was a polyimide film and its thickness was 13 µm.
[0049] After the feeding of the copper foil was finished and before the feeding of the polyimide
film was started, the trailing edge of the copper foil and the leading edge of the
polyimide film was made to overlap (with a length of overlap of 300 mm) and joined
with a double-coated adhesive tape. At the same time, a resin bonding layer comprising
a thermoplastic polyimide film was interposed therebetween. As the thermoplastic polyimide
film, there was used a polyimide film [manufactured by Kaneka Corp. under the trade
name of Apical; having a thickness of 25 µm] having thermoplastic polyimide layers
(each having a thickness of 8 µm) on both sides thereof.
[0050] In order to prepare the aforesaid thermoplastic polyimide, polyamic acid varnish
obtained by mixing 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride with 1,3'-bis(3-aminophenoxy)benezene
in dimethylacetamide at room temperature was used as a starting material. This polyamic
acid was applied to the aforesaid polyimide film, dried and imidized to form a thermoplastic
polyimide layer. The temperature used for this purpose was 300°C.
[0051] A material locking device was operated to bring the overlapping part to a standstill
within a hot press. Using hot platens disposed on both sides, the overlapping part
was pressed at a pressure of 0.1 kgf/cm
2 and a temperature of 300°C for 30 seconds.
Observation of the joint revealed that the sheet materials were satisfactorily joined
together. The hot platens were provided with a raised pattern so that the pressure
of the press is focused on the raised regions. The pressure calculated from the area
of the raised regions was 1.0 kgf/cm
2.
[0052] Following the copper foil, the polyimide film was fed to the drying furnace having
a temperature of 300°C and processed therein. The tension applied to the sheet material
being processed was 5 kgf/cm, indicating that a great tensile force was exerted thereon.
However, the sheet material was satisfactorily processed without suffering from any
trouble such as breakage, meandering, or variation in tension.
Example 2
[0053] In Example 2, the processing temperature was set at 250°C and the same apparatus
as in Example 1 was used. The sheet material being processed and the sheet material
to be connected comprised a copper film and a polyimide film, respectively, which
were similar to those used in Example 1. As the thermoplastic polyimide film, there
was used a film manufactured by Mitsui Chemical Industry Co., Ltd. under the trade
name of Regulus. Hot pressing was performed at a pressure of 0.1 kgf/cm
2 and a temperature of 340°C for 1 minute. At the joint, the sheet materials were satisfactorily
joined together. Following the copper foil, the polyimide film was fed to the furnace.
The sheet material being processed was exposed to a temperature of 250°C and a tension
of 10 kgf/m. However, the sheet material was satisfactorily processed without suffering
from any trouble such as breakage, meandering, or variation in tension.
Effects of the Invention
[0054] According to the present invention, sheet materials are connected in end-to-end relationship
by thermocompression boding using a resin bonding layer as the bonding layer. Thus,
even where a subsequent processing step is carried out under severe conditions including
a temperature in the range of 200°C to less than 550°C and a tension in the range
of 0.1 to 50 kgf/cm, the sheet materials can be satisfactorily processed without suffering
from breakage, separation, meandering, variation in tension, or the like. Moreover,
by connecting sheet materials according to the present invention, they can be connected
stably and efficiently, and they can be fed to a subsequent step at a constant feed
speed.
Brief Description of the Drawings
FIG. 1
[0055] FIG. 1 is a view of one form of apparatus used for carrying out the method for forming
a continuous material by connecting sheet materials in accordance with the present
invention, illustrating the sheet materials having a resin bonding layer (a thermoplastic
polyimide film) interposed therebetween;
FIG. 2
[0056] FIG. 2 is a view of one form of apparatus used for carrying out the method for forming
a continuous material by connecting sheet materials in accordance with the present
invention, illustrating the sheet materials whose joined part has come to a standstill
within a hot press;
FIG. 3
[0057] FIG. 3 is a view of one form of apparatus used for carrying out the method for forming
a continuous material by connecting sheet materials in accordance with the present
invention, illustrating the sheet materials being subjected to thermocompression bonding
by operating the hot press; and
FIG. 4
[0058] FIG. 4 is a view of one form of apparatus used for carrying out the method for forming
a continuous material by connecting sheet materials in accordance with the present
invention, illustrating the completely connected sheet materials.
Definition of Characters
[0059]
- 1
- Hot press
- 2
- Material locking device
- 3
- Accumulator
- 4
- Sheet material being processed
- 5
- Resin bonding layer
- 6
- Sheet material to be processed
- 7
- Adhesive tape