BACKGROUND OF THE INVENTION
1. Field of the Invention
[0001] The present invention relates to an integrated circuit for processing an audio signal.
2. Description of the Related Art
[0002] An audio circuit for a vehicle is constructed by a circuit for creating, from an
input signal, stereophonic signals to be connected to a speaker installed at the front
of the vehicle (hereinafter referred to simply as "front speaker"), another speaker
installed at the rear of the vehicle (hereinafter referred to simply as "rear speaker")
and a sub-woofer speaker for emphasizing a low frequency band (hereinafter referred
to simply as "sub-woofer") and for changing the sound volume and frequency characteristic
of the input signal.
[0003] Fig. 2 is a block diagram of the configuration of a conventional audio circuit.
[0004] In the conventional audio circuit, an input audio signal is amplified by an amplifier
10. The amplified audio signal is separated in tents of frequency by a high-pass filter
11, band-pass filter 12 and a low-pass filter 13. The respective frequency components
are connected to the corresponding attenuators which change the frequency characteristic
of the input signal.
[0005] The signal whose frequency characteristic has been changed is controlled in its output
volume by a volume controller 17 and fader 18. Thus, a front output signal and a rear
output signal, which are outputted to a front speaker and rear speaker, are produced.
A sub-woofer signal to be outputted to a sub-woofer speaker is produced from the rear
output signal through a low-pass filter 19.
[0006] The above conventional audio circuit, which is composed of individual circuit components,
is expensive in production cost. In addition, it has been demanded that the characteristic
of each of the high-pass filter, band-pass filter and low-pass filter can be changed.
[0007] For this reason, the filtering was carried out by means of switched capacitor filters
or digital signal processing, and volume control was made in electronics. In this
way, the audio circuit was configured in a semiconductor integrated circuit.
[0008] Where the audio circuit is configured by a semiconductor integrated circuit, the
number of pins to connected to the integrated circuit is problematic. The number of
pins is prescribed for a common integrated circuit. For example, if the number of
input/output pins is 44 or less, the integrated circuit with 44 pins is used. However,
the number of input/output pins exceeds 44, the integrated circuit with 64 pins which
is one-rank higher in the number of pins must be used.
[0009] The one-rank higher integrated circuit, which has an increased number of pins, increases
the freedom of circuit design. However, it increases a leak current from the packaged
portion. This attenuates the reliability and increases the production cost. Therefore,
in designing an internal circuit of the integrated circuit, how the number of input/output
pins is reduced is critical.
SUMMARY OF THE INVENTION
[0010] An object of the present invention is to provide an integrated circuit for processing
an audio signal having a reduced number of input/output pins.
[0011] In order to attain the above object, there is provided an integrated circuit for
processing an audio signal comprising: means for processing an input audio signal
to create a front output signal, rear output signal and a sub-woofer output signal
which are to be outputted to a front speaker, a rear speaker and a sub-woofer; and
first switch means for selecting the rear output signal or the sub-woofer output signal,
an output from the switch means being connected to a common output for the front speaker
and the sub-woofer.
[0012] In this configuration, the number of input/output terminals can be reduced.
[0013] Preferably, the integrated circuit further comprises a high-pass filter for inhibiting
a low frequency band of the front output signal from passing; and second switch means
for selecting an output signal from the high-pass filter or the front output signal,
an output from the second switch means being connected to an output to the front speaker.
[0014] In this configuration, while the output signal from the sub-woofer is outputted from
the rear output terminal, if the front output signal is passed through the high-pass
filter, the distortion of signal from the front speaker in a low frequency band can
be removed.
[0015] The above and other object and features of the present invention will be more apparent
from the following description taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016]
Fig. 1 is a schematic diagram of the configuration of an embodiment of the integrated
circuit for processing an audio signal according to the present invention; and
Fig. 2 is a block diagram of a configuration of a conventional audio circuit.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0017] Now referring to Fig. 1, an explanation will be given of an embodiment of the integrated
circuit for processing an audio signal according to the present invention. Fig. 1
is a schematic diagram of the configuration of this embodiment. In Fig. 1, like reference
numerals refer to like elements in Fig. 2 showing the conventional audio circuit.
Subscript R assigned to each reference numeral is directed to the line carrying the
signal at an R (right) channel whereas subscript L assigned to each reference numeral
is directed to the line carrying the signal at an L (left) channel.
[0018] In the integrated circuit 1 as shown in Fig. 1, rear output signals produced from
faders 18R and 18L for the R channel and L channel are added to each other by an adder
7 to provide a monophonic signal. The monophonic signal is passed through a low-pass
filter (LPF) 8 to produce a low frequency signal. The rear output signals from the
faders 18R and 18L or the signal from the LPF 8 are selected by switches 4R and 4L,
respectively.
[0019] The front output signals produced from faders 18R and 18L for the R channel and L
channel are passed through high-pass filters (HPFs) 5R and 5L to provide high frequency
signals with the lower frequency component stopped. The signals having passed through
the HPFs 5R and 5L or the front output signals are selected by switches 6R and 6L,
respectively. The signal selected by the switch 4R or the signal selected by the switch
6R is selected by a switch 9R. The signal selected by the switch 4L or the signal
selected by the switch 6L is selected by a switch 9L.
[0020] The signal selected by the switch 6R goes to the front output terminal 3R at the
R channel; the signal selected by the switches 4R and 9R goes to the rear output terminal
2R at the R channel; and the signal selected by only the switch 4R goes to a pre-output
terminal 20R at the R channel. This applies to the L channel side.
[0021] In this configuration, as seen from Fig. 1, the front output terminals 3R and 3L
are connected to power amplifiers for front R-channel and front L-channel, respectively.
The outputs from these power amplifiers are connected to front speakers for the front
R channel and front L channel, respectively. On the other hand, the rear output terminals
2R and 2L are connected to power amplifiers for rear R-channel and front L-channel,
respectively. The outputs from these power amplifiers are connected to rear speakers
for the rear R channel and rear L channel, respectively. In this case, the switches
6R and 6L are set at the side where the front signals from the faders 18R and 18L
are directly supplied, whereas the switches 4R and 4L are set at the side where the
rear signals from the faders 18R and 18L are directly supplied. In addition, the switches
9R and 9L are set to select the sides of the switches 4R and 4L.
[0022] By connecting these switches in this manner, the front signals at the R channel and
L channel are guided to the front output terminals 3R and 3L, respectively so that
the front power amplifiers drive the front speakers, respectively. Further, the rear
signals at the R channel and L channel are guided to the rear output terminals 2R
and 2L through the switches 4R, 4L and 9R, 9L, respectively so that the rear power
amplifiers drive the rear speakers, respectively.
[0023] By connecting the switches 9R, 9L to the switches 6R, 6L, the front signals from
the faders 18R, 18L are directly supplied so that the rear power amplifiers drive
the rear speakers, respectively. The signal levels supplied to the front speakers
and rear speakers by the faders 18R and 18L are controlled independently or correlatively.
[0024] Next, the front output terminals 3R and 3L are connected to power amplifiers for
front R-channel and front L-channel, respectively. The outputs from these power amplifiers
are connected to speakers for the front R channel and front L channel, respectively.
On the other hand, the rear output terminals 2R and/or 2L are connected to power amplifiers
for driving the sub-woofers, respectively. Further, when the sub-woofers are connected
to the power amplifiers therefor, the switches 6R, 6L are connected to the signals
passed through the HPFs 5R and 5L, the switches 4R, 4L are connected to the LPF 8,
and the switches 9R, 9L are connected to the switches 4R, 4L, respectively.
[0025] By connecting the switches in the manner described above, the front signals at the
R channel and L channel with the low frequency band suppressed are guided to the front
output terminals 3R and 3L. In addition, the low-frequency monophonic signals passed
through the adder 7 and LPF 8 are guided to the rear output terminals 2R and 2L. Thus,
the power amplifiers for the sub-woofers drive the sub-woofers. Further, since the
low frequency band of the signals supplied to the front speakers is stopped by the
HPFs 5R and 5L, the distortion of the outputs from the front speakers can be reduced.
Incidentally, in such a setting state, according to the acoustic status within the
vehicle, the outputs from the faders 18R and 18L may be directly guided to the front
output terminals 3R and 3L through the switches 6R and 6L.
[0026] In the embodiment described above, the power amplifiers for driving the respective
speakers may be integrated into a power IC. Where the power IC is connected, the pre-output
terminals may be connected to other power amplifiers for the R channel and L channel
so as to drive the rear speakers. Further, the pre-output terminals 20R and 20L may
be connected to an external circuit having the same configuration as the adder 7 and
LPF 8, and connected to other amplifiers for the sub-woofers so as to drive the sub-woofers.