High density electrical interconnect for a continuous ink jet printhead

(19)

(11)

EP 1 013 430 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	04.04.2001 Bulletin 2001/14

(43)	Date of publication A2:
	28.06.2000 Bulletin 2000/26

(21)	Application number: 99309493.7

(22)	Date of filing: 29.11.1999

(51)	International Patent Classification (IPC)⁷: B41J 2/14, B41J 2/02, B41J 2/085

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

14.12.1998 US 211212

(71)	Applicant: Scitex Digital Printing, Inc.
	Dayton, Ohio 45420-4099 (US)

(72)	Inventors:
	Woolard, Daniel E. Dayton, Ohio 45419-1855 (US) Simon, Robert J. Bellbrook, Ohio 45305 (US) Bowling, Bruce A. Beavercreek, Ohio 45432 (US)

(74)	Representative: Freed, Arthur Woolf et al
	Reginald W. Barker & Co., Clifford's Inn, Fetter Lane London EC4A 1BY London EC4A 1BY (GB)

(54)	High density electrical interconnect for a continuous ink jet printhead

(57) Recognizing the need for longer ink jet arrays with higher print densities and the concurrent need for minimal overall size of the printhead, the present invention proposes a system and method for establishing a high-density electrical interconnection between high-voltage driver chips and charging electrodes controlled by the driver chips. A charge plate has a charging electrode density on its face, and an associated mating circuit. Alignment features are then provided on the charge plate and/or the mating circuit. The alignment features of the charge plate and the mating circuit are mechanically engaged to ensure alignment of mating contact pads. And an interconnect is provided for the aligned mating contact pads.

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