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(11) | EP 1 013 432 A3 |
(12) | EUROPEAN PATENT APPLICATION |
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(54) | Cooling of high voltage driver chips |
(57) A compact cooling technique is provided for cooling an ink jet printer or printhead
electronics. A cooling plate (18) is held in good thermal contact to the integrated
circuits (12) to be cooled. Fluid passing through the cooling plate then cools the
electronics. The cooling plate is typically an aluminum plate embedded with thin walled
stainless steel tubing through which fluid flows to provide cooling. The cooling plate
has a compliant pad (26) which is thermally conductive, and electrically insulated.
The plate and pad combination is held against the integrated circuits for controlling
the high voltage to the charging electrodes, which are mounted on the charge driver
board. The integrated circuit is packaged in a cavity down ball grid array (BGA) package
which provides low thermal resistance to the cooling plate. Variations in the height
of the charge driver chips is compensated for by the compliant thermal pad. The fluid
is routed through the printhead frame into the cold plate where heat is transferred
to the fluid which returns to the printhead frame to exit the printhead. The fluid
is ported into the printhead to where the drops will be generated. |