IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME - Patent 1021831

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EP 1 021 831 A1

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(43)	Date of publication:
	26.07.2000 Bulletin 2000/30

(21)	Application number: 98910140.7

(22)	Date of filing: 05.01.1998

(51)	International Patent Classification (IPC)⁷: H01L 23/48

(86)	International application number:
	PCT/US9804/119

(87)	International publication number:
	WO 9834/277 (06.08.1998 Gazette 1998/31)

(84)	Designated Contracting States:
	AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

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Priority:

30.01.1997 US 790779

(71)	Applicant: GCB Technologies, Inc
	Saratoga, CA 95070 (US)

(72)	Inventors:
	BUCCI, Guiseppe, D. Monte Sereno, CA 95030 (US) VOISIN, Paul, H. San Mateo, CA 94402 (US)

(74)	Representative: Manitz, Finsterwald & Partner
	Postfach 22 16 11 80506 München 80506 München (DE)

(54)	IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME