VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH THERMALLY CONDUCTIVE EPOXY PREFORM - Patent 1029346

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EP 1 029 346 A1

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(43)	Date of publication:
	23.08.2000 Bulletin 2000/34

(21)	Application number: 98943211.7

(22)	Date of filing: 14.08.1998

(51)	International Patent Classification (IPC)⁷: H01L 21/44, H01L 21/48, H01L 21/50

(86)	International application number:
	PCT/US9816/901

(87)	International publication number:
	WO 9910/925 (04.03.1999 Gazette 1999/09)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

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Priority:

22.08.1997 US 918501
22.08.1997 US 918502

(71)	Applicant: CUBIC MEMORY
	Scotts Valley, CA 95066 (US)

(72)	Inventors:
	VINDASIUS, Alfons Saratoga, CA 95070 (US) SAUTTER, Kenneth, M. Sunnyvale, CA 94086 (US)

(74)	Representative: Hutchinson, Glenn Stanley
	Harrison Goddard FooteFountain PrecinctBalm Green Sheffield S1 1RZ Sheffield S1 1RZ (GB)

(54)	VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH THERMALLY CONDUCTIVE EPOXY PREFORM