(19)
(11) EP 1 038 418 A1

(12)

(43) Date of publication:
27.09.2000 Bulletin 2000/39

(21) Application number: 99970262.4

(22) Date of filing: 07.10.1999
(51) International Patent Classification (IPC)7H05K 3/02, H01L 21/48
(86) International application number:
PCT/JP9905/531
(87) International publication number:
WO 0021/345 (13.04.2000 Gazette 2000/15)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 07.10.1998 JP 28524698

(71) Applicant: Matsushita Electric Industrial Co., Ltd.
Kadoma-shi,Osaka 571-8501 (JP)

(72) Inventors:
  • OCHI, Hiroshi
    Saijo-shiEhime 793-0043 (JP)
  • SEGAWA, Shigetoshi
    Niihama-shiEhime 792-0050 (JP)

(74) Representative: Kügele, Bernhard et al
NOVAPAT INTERNATIONAL SA,9, Rue du Valais
1202 Genève
1202 Genève (CH)

   


(54) MANUFACTURING METHOD OF WIRING CIRCUIT BOARD, AND WIRING CIRCUIT BOARD