(19)
(11)
EP 1 038 418 A1
(12)
(43)
Date of publication:
27.09.2000
Bulletin 2000/39
(21)
Application number:
99970262.4
(22)
Date of filing:
07.10.1999
(51)
International Patent Classification (IPC)
7
:
H05K
3/02
,
H01L
21/48
(86)
International application number:
PCT/JP9905/531
(87)
International publication number:
WO 0021/345
(
13.04.2000
Gazette 2000/15)
(84)
Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
(30)
Priority:
07.10.1998
JP 28524698
(71)
Applicant:
Matsushita Electric Industrial Co., Ltd.
Kadoma-shi,Osaka 571-8501 (JP)
(72)
Inventors:
OCHI, Hiroshi
Saijo-shiEhime 793-0043 (JP)
SEGAWA, Shigetoshi
Niihama-shiEhime 792-0050 (JP)
(74)
Representative:
Kügele, Bernhard et al
NOVAPAT INTERNATIONAL SA,9, Rue du Valais
1202 Genève
1202 Genève (CH)
(54)
MANUFACTURING METHOD OF WIRING CIRCUIT BOARD, AND WIRING CIRCUIT BOARD