Flip chip package for micromachined semiconductors

(19)

(11)

EP 1 057 779 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	11.09.2002 Bulletin 2002/37

(43)	Date of publication A2:
	06.12.2000 Bulletin 2000/49

(21)	Application number: 00303286.9

(22)	Date of filing: 18.04.2000

(51)	International Patent Classification (IPC)⁷: B81B 7/00

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

03.06.1999 US 325282

(71)	Applicant: CTS Corporation
	Elkhart, Indiana 46514-1899 (US)

(72)	Inventor:
	Hinds, Ronald L Benton, IN 47970 (US)

(74)	Representative: Loven, Keith James et al
	Loven & Co Quantum House 30 Tentercroft Street Lincoln LN5 7DB Lincoln LN5 7DB (GB)

(54)	Flip chip package for micromachined semiconductors

(57) A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and are electrically connected to the vias. A micrornachined semiconductor device abuts the bottom surface and covers the cavity such that a movable portion of the micromachined semiconductor device is unconstrained to move within the cavity. Solder is used to connect the vias to solder bumps on the semiconductor device. A seal ring is located between the micromachined semiconductor device and the ceramic assembly for hermetically sealing the micromachined semiconductor device.

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