Method of producing a dielectric strip line

(19)

(11)

EP 1 065 745 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	28.03.2007 Bulletin 2007/13

(43)	Date of publication A2:
	03.01.2001 Bulletin 2001/01

(21)	Application number: 00112723.2

(22)	Date of filing: 15.06.2000

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International Patent Classification (IPC):

H01P 3/16^(2006.01)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

24.06.1999 JP 17879099

(71)	Applicant: MURATA MANUFACTURING CO., LTD.
	Nagaokakyo-shi Kyoto-fu 617-8555 (JP)

(72)	Inventors:
	Takeda, Toshikazu, (A170) Intellectual Prop. Dept. Nagaokakyo-shi, Kyoto-fu 617-8555 (JP) Ogiso, Yoshifumi, (A170) Intellectual Prop. Dept. Nagaokakyo-shi, Kyoto-fu 617-8555 (JP) Hamaji, Yukio, (A170) Intellectual Prop. Dept. Nagaokakyo-shi, Kyoto-fu 617-8555 (JP)

(74)	Representative: Gossel, Hans K. et al
	Lorenz-Seidler-Gossel Widenmayerstrasse 23 80538 München 80538 München (DE)

(54)	Method of producing a dielectric strip line

(57) The present invention provides a method of producing a dielectric line which is capable of producing a dielectric line at low cost with causing neither cracks nor chips in processing and high precision of each dimension of a dielectric strip. The method of producing a dielectric line having a dielectric strip provided between a plurality of substantially parallel conductive planes includes the step of forming a resist material on a green sheet containing at least an inorganic powder and an organic binder; the step of removing a desired amount of the green sheet corresponding to an aperture of the resist material used as a mask; the step of removing the resist material; and the step of burning the green sheet.

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