| (19) |
 |
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(11) |
EP 1 069 211 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
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17.12.2003 Bulletin 2003/51 |
| (43) |
Date of publication A2: |
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17.01.2001 Bulletin 2001/03 |
| (22) |
Date of filing: 13.07.2000 |
|
| (51) |
International Patent Classification (IPC)7: C25D 3/38 |
|
| (84) |
Designated Contracting States: |
|
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
Designated Extension States: |
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AL LT LV MK RO SI |
| (30) |
Priority: |
15.07.1999 US 144159 P
31.05.2000 US 583599
|
| (71) |
Applicant: THE BOC GROUP, INC. |
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Murray Hill, New Providence, New Jersey 07974-2082 (US) |
|
| (72) |
Inventors: |
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- Wang, Qing Min
North Plainfield, New Jersey 07060 (US)
- Huang, Weiji
Bound Brook, New Jersey 08805 (US)
- Lau, Miu Ling
Edison, New Jersey 08820 (US)
- Liu, Carol Hsiuchin
Union, New Jersey 07083 (US)
- Ma, Ce
Apex, North Carolina 27502 (US)
- Chang, Edward K.
Gillette, New Jersey 07933 (US)
- Ho, Wenpin
North Arlington, New Jersey 07031 (US)
- Paciej, Richard C.
Gladstone, New Jersey 07934 (US)
|
| (74) |
Representative: Bousfield, Roger James et al |
|
The BOC Group plc Chertsey Road
Windlesham Surrey GU20 6HJ
Windlesham Surrey GU20 6HJ (GB) |
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| |
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| (54) |
Electroplating solutions |
(57) An acid copper electroplating composition comprising an aqueous solution of an acid
and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing
organic brightener compound and a leveller compound which comprises an organic compound
containing single or multiple charged centres are present.