ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYAL..............................JDIM350 (Ver 2.1 Jan 2001) 1620000/01069211EUROPEAN PATENT APPLICATIONA320031217EP00305941.720000713EnEnEn144159 P19990715US58359920000531US20031217200351200101172001037 7C 25D 3/38 AdeElektroplattierungslösungenenElectroplating solutionsfrSolutions pour l'électroplacageTHE BOC GROUP, INC.0020509799A209/RJBBOC GROUP, INC., THE575 Mountain AvenueMurray Hill, New Providence, New Jersey 07974-2082USWang, Qing Min375 North Drive, Apt. C-2North Plainfield, New Jersey 07060USHuang, Weiji7 Crest DriveBound Brook, New Jersey 08805USLau, Miu Ling7 Corrine StreetEdison, New Jersey 08820USLiu, Carol Hsiuchin2571 Spruce StreetUnion, New Jersey 07083USMa, Ce107 Hadley Creek DriveApex, North Carolina 27502USChang, Edward K.611 Long Hill RoadGillette, New Jersey 07933USHo, Wenpin21 Pershing PlaceNorth Arlington, New Jersey 07031USPaciej, Richard C.7 Brookside DriveGladstone, New Jersey 07934USBousfield, Roger Jameset al00028494The BOC Group plc Chertsey RoadWindlesham Surrey GU20 6HJGBATBECHCYDEDKESFIFRGBGRIEITLILUMCNLPTSEALLTLVMKROSI20031217200351

An acid copper electroplating composition comprising an aqueous solution of an acid and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing organic brightener compound and a leveller compound which comprises an organic compound containing single or multiple charged centres are present.