(19)
(11) EP 1 080 907 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
09.01.2002 Bulletin 2002/02

(43) Date of publication A2:
07.03.2001 Bulletin 2001/10

(21) Application number: 00307222.0

(22) Date of filing: 22.08.2000
(51) International Patent Classification (IPC)7: B41J 2/16
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 25.08.1999 US 383109

(71) Applicant: Hewlett-Packard Company, A Delaware Corporation
Palo Alto, CA 94304 (US)

(72) Inventors:
  • Tan, Kee Cheong
    Singapore 266467 (SG)
  • Chou, Sean Weai
    Singapore 270008 (SG)
  • Te, Bun Chay
    Singapore 141082 (SG)

(74) Representative: Powell, Stephen David et al
WILLIAMS, POWELL & ASSOCIATES 4 St Paul's Churchyard
London EC4M 8AY
London EC4M 8AY (GB)

   


(54) Manufacturing printheads


(57) A method for fabricating thin-film ink-jet printheads includes a step (14) of electroforming individualized orifice plates (16) on a surface of a mandrel (6). After the orifice plates are formed, the mandrel is aligned with a wafer (24) to allow the orifice plates to be aligned with their corresponding printhead dies (26) concurrently. After that, polymeric adhesive (28) on the printheads dies is cured to allow the orifice plates to be adhered to the corresponding printhead dies. The mandrel is then separated (36) from the orifice plates. The printhead dies on the wafer is finally singulated (38) to produce individual thin-film ink-jet printheads.






Search report