Multichip module packaging process for known good die burn-in

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EP 1 081 757 B8

(12)	CORRECTED EUROPEAN PATENT SPECIFICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 B1)

(48)	Corrigendum issued on:
	07.06.2017 Bulletin 2017/23

(45)	Mention of the grant of the patent:
	07.12.2016 Bulletin 2016/49

(21)	Application number: 00118199.9

(22)	Date of filing: 31.08.2000

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International Patent Classification (IPC):

H01L 23/31^(2006.01)
H01L 23/544^(2006.01)

H01L 21/66^(2006.01)
H01L 23/00^(2006.01)

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Multichip module packaging process for known good die burn-in

Verpackungs-Verfahren für Vielchip-Modul mit Einbrenn-Test zur Erhaltung von als gut erkannten Chips ("Known Good Die")

Procédé d'empaquetage d'un module multipuce avec déverminage en vue de l'obtention de puces reconnues bonnes ("known good die")

(84)	Designated Contracting States:
	DE GB

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Priority:

01.09.1999 US 388997

(43)	Date of publication of application:
	07.03.2001 Bulletin 2001/10

(73)	Proprietor: S3 Graphics Co., Ltd.
	Grand Cayman (KY)

(72)	Inventor:
	Young I. Kwon San Jose, Calfornia 95120 (US)

(74)	Representative: Käck, Stefan et al
	Kahler Käck Mollekopf Partnerschaft von Patentanwälten mbB Vorderer Anger 239 86899 Landsberg/Lech 86899 Landsberg/Lech (DE)

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References cited: :

US-A- 4 344 064
US-A- 5 754 410

US-A- 5 280 193

PATENT ABSTRACTS OF JAPAN vol. 017, no. 160 (E-1342), 29 March 1993 (1993-03-29) -& JP 04 322439 A (MATSUSHITA ELECTRIC IND CO LTD), 12 November 1992 (1992-11-12)
PATENT ABSTRACTS OF JAPAN vol. 017, no. 398 (E-1403), 26 July 1993 (1993-07-26) -& JP 05 074829 A (HITACHI LTD;OTHERS: 01), 26 March 1993 (1993-03-26)

Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).