METHOD AND APPARATUS FOR DETERMINING PROCESSING CHAMBER CLEANING OR WAFER ETCHING ENDPOINT - Patent 1086353

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EP 1 086 353 A1

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(43)	Date of publication:
	28.03.2001 Bulletin 2001/13

(21)	Application number: 99928616.4

(22)	Date of filing: 11.06.1999

(51)	International Patent Classification (IPC)⁷: G01B 9/02

(86)	International application number:
	PCT/US9913/339

(87)	International publication number:
	WO 9964/814 (16.12.1999 Gazette 1999/50)

(84)	Designated Contracting States:
	AT BE DE ES FI FR GB IE IT NL SE

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Priority:

12.06.1998 US 89089 P
10.06.1999 US 329520

(71)	Applicant: ON-LINE TECHNOLOGIES, INC.
	East Hartford, CT 06138-0379 (US)

(72)	Inventors:
	SPARTZ, Martin, L. East Windsor, CT 06088 (US) BONANNO, Anthony, S. Windsor, CT 06095 (US) ROSENTHAL, Peter, A. West Simsbury, CT 06107 (US) RICHTER, Matthew San Jose, CA 95116 (US)

(74)	Representative: Jackson, Derek Charles
	Derek Jackson Associates,The Old Yard,Lower Town Claines,Worcester WR3 7RY Claines,Worcester WR3 7RY (GB)

(54)	METHOD AND APPARATUS FOR DETERMINING PROCESSING CHAMBER CLEANING OR WAFER ETCHING ENDPOINT