......DE......GB....................................................................................JDIM360 Ver 2.15 (14 Jul 2008) - 2999001/01089334CORRECTED EUROPEAN PATENT SPECIFICATIONB8B120110921W173deBibliographieenBibliographyfrBibliographieEP00120263.9200009272000092720060119enenen2748179919990928JP2775899919990929JP2011092120113820010404200114201106222011252011011220110921201138H01L 23/373 20060101AFI20001228BHEP H01L 23/13 20060101ALI20001228BHEP deKeramikleiterplatteenCeramic circuit boardfrPanneau circuit en céramiqueEP-A- 0 422 558EP-A- 0 693 776EP-A- 0 874 399EP-A- 0 935 286EP-A- 1 056 321US-A- 4 602 731US-A- 5 213 877US-A- 5 527 620PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08, 30 June 1998 (1998-06-30) -& JP 10 065296 A (MITSUBISHI MATERIALS CORP), 6 March 1998 (1998-03-06)06013119.017013812006062606013121.6172241120060626Naba, Takayuki3-14, Heiwa-choChigasaki-shi, Kanagawa-kenJPKomorita, Hiroshi2-19-1-205, Minowa-cho, Kouhoku-kuYokohama-shi, Kanagawa-kenJPNakayama, Noritaka1931-631, Kizukisumiyoshi-cho, Nakahara-kuKawasaki-shi, Kanagawa-kenJPIyogi, Kiyoshi2-2-14-1003, Asada, Kawasaki-kuKawasaki-shi, Kanagawa-kenJPKabushiki Kaisha Toshiba10015427584 490 a/km72, Horikawa-cho, Saiwai-ku, Kawasaki-shi,Kanagawa-kenJPHOFFMANN EITLE100061036Patent- und Rechtsanwälte Arabellastraße 481925 MünchenDEDEGB20051109200545