FLIP CHIP DEVICES WITH FLEXIBLE CONDUCTIVE ADHESIVE - Patent 1090535

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EP 1 090 535 A1

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(43)	Date of publication:
	11.04.2001 Bulletin 2001/15

(21)	Application number: 99921432.3

(22)	Date of filing: 22.04.1999

(51)	International Patent Classification (IPC)⁷: H05K 1/18

(86)	International application number:
	PCT/US9908/787

(87)	International publication number:
	WO 9956/509 (04.11.1999 Gazette 1999/44)

(84)	Designated Contracting States:
	DE FR GB

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Priority:

24.04.1998 US 82885 P
28.04.1998 US 83326 P
09.07.1998 US 92147 P
05.10.1998 US 166633
25.03.1999 US 276259

(71)	Applicant: Amerasia International Technology, Inc.
	Princeton Junction, NJ 08550 (US)

(72)	Inventor:
	CHUNG, Kevin, Kwong-Tai Princeton, NJ 08540 (US)

(74)	Representative: Helbing, Jörg, Dr. Dipl.-Chem. et al
	Patentanwältevon Kreisler-Selting-Werner,Postfach 10 22 41 50462 Köln 50462 Köln (DE)

(54)	FLIP CHIP DEVICES WITH FLEXIBLE CONDUCTIVE ADHESIVE