Low profile high density sockets and related method of manufacturing

(19)

(11)

EP 1 094 556 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	24.10.2001 Bulletin 2001/43

(43)	Date of publication A2:
	25.04.2001 Bulletin 2001/17

(21)	Application number: 00122236.3

(22)	Date of filing: 17.10.2000

(51)	International Patent Classification (IPC)⁷: H01R 12/22, H01R 13/24

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

20.10.1999 US 421716

(71)	Applicant: BERG ELECTRONICS MANUFACTURING B.V.
	5202 CB'S-Hertogenbosch (NL)

(72)	Inventor:
	Belopolsky, Yakov Harrisburg, PA 17112 (US)

(74)	Representative: Beetz & Partner Patentanwälte
	Steinsdorfstrasse 10 80538 München 80538 München (DE)

(54)	Low profile high density sockets and related method of manufacturing

(57) The invention resides in an electrical connector (2) capable of being used in an array of contact element (12, 12', 12'') disposed between two parallel spaced apart plates defining a gap (70) into which the connector (2) is inserted. The connector (2) employs a plurality of spacer bars (14) on which are carried a plurality of contact rings which are spaced apart from one another by one or more spacer elements (16, 16'). The position of the contact elements (12, 12', 12'') can be readily varied from one spacer bar (14) to the other by the addition or elimination of one or more spacers to customize the contact array for adapting to the contact placement on the contact plates. Another embodiment of the invention may include using spacer rods made from an elastomeric material which can be stretched to allow the contact rings to be slid over a necked down portion of the rod (16).

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