Adhesion method and electronic component

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EP 1 108 766 A9

(12)	CORRECTED EUROPEAN PATENT APPLICATION

(48)	Corrigendum issued on:
	03.04.2002 Bulletin 2002/14

(88)	Date of publication A3:
	19.09.2001 Bulletin 2001/38

(43)	Date of publication:
	20.06.2001 Bulletin 2001/25

(21)	Application number: 00311186.1

(22)	Date of filing: 14.12.2000

(51)	International Patent Classification (IPC)⁷: C09J 5/00, C09J 5/06, C09J 11/04, C09J 9/00, C08K 3/38, H01L 23/373, H01L 23/433, H01L 21/56, H01L 21/58, H01L 23/495

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

17.12.1999 JP 35864799

(71)	Applicant: POLYMATECH CO., LTD.
	Chuo-Ku, Tokyo (JP)

(72)	Inventors:
	Tobita, Masayuki Kita-ku, Tokyo (JP) Tateda, Shinya Kita-ku, Tokyo (JP) Kimura, Tsunehisa Chohu-shi, Tokyo (JP) Yamato, Masahumi Hachioji-Shi Tokyo (JP)

(74)	Representative: Whalley, Kevin
	MARKS & CLERK, 57-60 Lincoln's Inn Fields London WC2A 3LS London WC2A 3LS (GB)

(54)	Adhesion method and electronic component

(57) The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to a fixed direction under the magnetic atmosphere. The invention also provides an electronic component for effectively dissipating heat generated from a semiconductor device (2), power source (4), light source or other components used for electric products, and an electronic component having excellent radiation.

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