(19)
(11) EP 1 114 450 A1

(12)

(43) Date of publication:
11.07.2001 Bulletin 2001/28

(21) Application number: 99936188.4

(22) Date of filing: 14.07.1999
(51) International Patent Classification (IPC)7: H01L 21/288, H01L 23/48, H01L 23/482, H01L 23/485
(86) International application number:
PCT/BE9900/090
(87) International publication number:
WO 0007/229 (10.02.2000 Gazette 2000/06)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 24.07.1998 US 93974

(71) Applicants:
  • INTERUNIVERSITAIRE MICROELEKTRONICA CENTRUM VZW
    3001 Leuven (BE)
  • SIEMENS AKTIENGESELLSCHAFT
    80333 München (DE)

(72) Inventors:
  • VAN STEENKISTE, Filip
    B-9870 Machelen (BE)
  • BAERT, Kris
    B-3001 Leuven (BE)
  • GUMBRECHT, Walter
    D-91074 Herzogenaurach (DE)
  • ARQUINT, Philippe
    D-91074 Herzogenaurach (DE)

(74) Representative: Van Malderen, Joelle et al
Office Van Malderen,Place Reine Fabiola 6/1
1083 Bruxelles
1083 Bruxelles (BE)

   


(54) A SYSTEM AND A METHOD FOR PLATING OF A CONDUCTIVE PATTERN