[0001] The present invention pertains to semiconductor based image sensors and more particularly
to Active Pixel image sensors (APS) having high sensitivity and increased dynamic
range.
[0002] APS are solid state imagers wherein each pixel contains both a photosensing means
and at least one other active component, creating a charge that is converted to a
signal (either a voltage or current signal). The signal represents the amount of light
incident upon a pixel photosite. The dynamic range (DR) of an imaging sensing device
is defined as the ratio of the effective maximum detectable signal level, typically
referred to as the saturation signal, (V
sat), with respect to the rms. noise level of the sensor, (σ
noise). This is shown in Equation 1.

[0003] Image sensor devices such as charge coupled devices (CCD) that integrate charge created
by incident photons have dynamic range limited by the amount of charge that can be
collected and held in a given photosite, (V
sat). For example, for any given CCD, the amount of charge that can be collected and
detected in a pixel is proportional to the pixel area. Thus for a commercial device
used in a megapixel digital still camera (DSC), the number of electrons representing
Vsat is on the order of 13,000 to 20,000 electrons. If the incident light is very
bright and creates more electrons that can be held in the pixel or photodetector,
these excess electrons are extracted by the anti-blooming means in the pixel and do
not contribute to an increased saturation signal. Hence, the maximum detectable signal
level is limited to the amount of charge that can be held in the photodetector or
pixel. The DR is also limited by the sensor noise level, σ
noise. Due to the limitations on Vsat, much work has been done in CCD's to decrease σ
noise to very low levels. Typically, commercial megapixel DSC devices have a DR of 1000:1
or less.
[0004] The same limitations on DR exist is for APS devices. The V
sat is limited by the amount of charge that can be held and isolated in the photodetector.
Excess charge is lost. This can become even more problematic with APS compared to
CCD due to the active components within the pixel in the APS, limiting the area available
for the photodetector, and due to the low voltage supply and clocks used in APS devices.
In addition, since APS devices have been used to provide image sensor systems on a
chip, the digital and analog circuits used on APS devices such as timing and control
and analog to digital conversion, that are not present on CCD's, provide a much higher
noise floor on APS devices compared to CCD. This is due to higher temporal noise as
well as possibly quantization noise from the on-chip analog to digital converter.
[0005] In commonly assigned U.S. Patent application 09/426,870,
Guidash explains the prior art approaches to extending dynamic range of APS devices, and
discloses a new invention to extend dynamic range by collection of the charge that
blooms from the photodetector. While that approach does provide extended dynamic range
with a small pixel, it has the potential disadvantage of spatial variation of the
photodetector saturation level contributing to fixed pattern noise in the sensor,
and does not increase the sensitivity of the sensor.
[0006] Prior art APS devices also suffer from poor sensitivity to light due to the limited
fill factor induced by integration of active components in the pixel, and by loss
of transmission of incident light through the color filter layer placed above the
pixel.
[0007] From the foregoing discussion it should be apparent that there remains a need within
the prior art for a device that retains provides extended dynamic range while retaining
low fixed pattern noise, small pixel, and high sensitivity.
[0008] According to the present invention, there is provided a solution to problems of the
prior art. In the present invention, the floating diffusion region in each pixel is
used as a separate photodetector region to provide extended dynamic range and high
sensitivity.
[0009] A first embodiment of the present invention provides extended dynamic range and higher
sensitivity by utilizing a floating diffusion region without a light shield provided
in each pixel as a separate photodetector region. During integration of signal charge
on the photodetector, charge is also collected on the floating diffusion in proportion
to the light incident on the floating diffusion region. In prior art devices the floating
diffusion region is used as the charge to voltage conversion node, as an overflow
drain for the photodetector during integration, or as a charge storage region for
global frame capture. As a result, the floating diffusion region is either shielded
from incident light, or is held in a reset mode to prevent the accumulation of charge
resulting from light incident on or near the floating diffusion region, and to drain
the blooming charge from the photodetector region . In the present invention charge
is integrated on the floating diffusion in proportion to the amount of light incident
upon the floating diffusion for a period of time that is controlled independently
from the photodetector integration time. The charge integrated on the floating diffusion
is then read out separately from the charge integrated on the photodetector. In this
first embodiment the photodetector and floating diffusion in a given pixel are covered
by the same color filter, or are both not covered by any color filter.
[0010] A second embodiment of the present invention provides extended dynamic range and
high sensitivity to incident light by utilizing the first embodiment with a different
or separate color filter for the photodetector and floating diffusion region in a
given pixel. This provides a signal charge associated with 2 colors per pixel.
[0011] According to the present invention, an active pixel sensor device that significantly
increases the dynamic range and sensitivity of the device, and can be used in current
system designs is provided by: an X-Y addressable imager having a plurality of the
pixels within the X-Y addressable imager with a photodetector within each of the plurality
of pixels configured to sense a first bandwidth of light; a sense node within each
of the pixels configured to sense a second bandwidth of light; a reset mechanism operatively
configured to the photodetector and the sense node to allow resetting each of the
photodetector and the sense node to a predetermined potential, the sense node being
formed such that it does not have a light shield allowing the sense node to act as
a second photodetector; and a transfer mechanism within each of plurality of pixels
configured to transfer charge from the photodetector to the sense node. The first
and second bandwidths can be different or the same depending upon design choices.
The X-Y addressable imager is envisioned as comprising a system with a first storage
mechanism to store a signal associated with charge accumulated on the sense node,
a second storage mechanism to store a signal associated with charge accumulated on
the photodetector and a timing circuit for controlling the integration and transfer
timing of the sense node and the photodetector for each of the plurality of pixels.
[0012] The invention has the following advantages. It provides for extending the dynamic
range and sensitivity of a sensor that can easily be employed within current sensor
and pixel designs with little or no modification. Small pixels with high fill factor
can provide separate signals from 2 colors per pixel.
Fig. 1a is a diagram of a pixel of a first embodiment of the present invention that
extends the dynamic range by integration of photoelectrons created from incident photons
on both the photodetector and floating diffusion;
Fig. 1b is a diagram of a pixel of a first embodiment of the present invention shown
in Fig. 1a further detailing the per column signal processing;
Fig. 2 is a timing diagram for the pixel shown in Fig. 1b;
Fig. 3a illustrates a pair of transfer functions for the pixel in Fig. 1b operated
by the timing diagram shown in Fig. 2 having a short floating diffusion integration
time leading to a small slope for linear region 2;
Fig. 3b illustrates a pair of transfer functions for the pixel in Fig. 1b operated
by the timing diagram shown in Fig. 2 having a relatively longer floating diffusion
integration time leading to a larger slope for linear region 2;
Fig. 4 is a timing diagram for the pixel shown in Fig. 1b; and
Fig. 5 is a diagram of a pixel of a second embodiment of the present invention that
extends the dynamic range by integration of photoelectrons created from incident photons
on both the photodetector and floating diffusion.
[0013] The first embodiment of the present invention provides extended dynamic range and
higher sensitivity by utilizing a floating diffusion region without a light shield
provided in each pixel as a separate photodetector region. During integration of signal
charge on the photodetector, charge is also collected on the floating diffusion in
proportion to the light incident on the floating diffusion region. The integration
time of the floating diffusion region is controlled independently from that of the
photodetector. This is accomplished using the pixel shown in Figs. la and 1b. This
is a similar pixel design to that disclosed by
Guidash in commonly assigned U.S. Patent applications 09/426,870 and 09/130,665. This pixel
10 comprises a photodetector 12 (preferably a pinned photodiode P), a transfer gate
16, a floating diffusion 18, a row select transistor 7, a reset transistor comprised
of a source being the floating diffusion 18, reset gate 17 and reset drain 19, and
a lateral overflow region 6.
[0014] Fig. lb is a diagram of a pixel of a first embodiment of the present invention shown
in Fig. la further detailing the per column signal processing. The pixel 10, illustrated
in Fig. lb, is preferably part of an X-Y addressable array of pixels that are arranged
in row and columns. Typically, the readout of charge accumulated within the pixels
is accomplished by selecting one row at a time and readout out the columns within
that row. Each column will have circuits for processing the outputs of the individual
pixels. The column circuits envisioned by the present invention are transistors 1,
2, and 3 which operate as switches under control of gate signals SHS
pd, SHR and SHS
fd to store signals within, respectively, capacitors C
4, C
5, and C
6. The signals from pixel 10 that are stored under control of SHS
pd, SHR and SHS
fd within capacitors C
4, C
5, and C
6 are used as inputs to differential amplifiers 31, 32 which compare a reset value
for the floating diffusion 18 with the accumulated signal values from each of the
floating diffusion 18 and the photodetector 12.
[0015] Operation of the first embodiment of the present invention is shown in the timing
diagram of Fig. 2 for the pixel 10 of Fig. 1b, resulting in the output signal transfer
function shown in Figs. 3a and 3b. Referring to Fig. 2, the pixel 10 is reset or initialized
by transferring charge from the photodetector 12 to the floating diffusion 18 by pulsing
of the transfer gate 16 (shown as signal TG) on and off, and the subsequent resetting
of the floating diffusion 18 by the activation of reset gate 17 which resets the floating
diffusion 18 to a potential determined by the reset gate pulse width, reset transistor
threshold voltage, and potential of the reset drain 19. The photodetector integration
time (t
intpd) commences when the transfer gate 16 is turned off after the initialization or reset
sequence. The reset gate is left on. The electrostatic potential of the lateral overflow
region is set at a level deeper than the transfer gate off potential so that excess
charge in the photodetector will bloom through the lateral overflow region and into
the reset drain of the adjacent pixel. The overflow mechanism prevents charge from
blooming into the floating diffusion and corrupting the charge accumulated on the
floating diffusion. The overflow mechanism can be any means known within the art.
As photodetector integration time (t
intpd) proceeds, the floating diffusion can also begin integration. The floating diffusion
integration time commences when the reset gate is turned off. The amount of time elapsed
between turning off the reset gate and the resetting of the floating diffusion is
referred to as the floating diffusion integration time, t
intfd. At the end of desired photodetector integration time, t
intpd, the level of charge integrated on the floating diffusion 18 is sampled and held
by pulsing SHS
fd which places the floating diffusion 18 signal on Capacitor C
4, followed by a reset of the floating diffusion 18 by RG and a sample and hold of
the reset level by SHR which places the floating diffusion reset level on Capacitor
C
5. Charge is then transferred from the photodetector 12 to the floating diffusion 18
by pulsing TG 16 on and off, and that signal level is then sampled and held by SHS
pd and placed on Capacitor C
6. The sampled and held signal levels from the photodetector and the floating diffusion
can then be added in the voltage domain to provide a total signal. One example of
this is shown in Fig. 1b. The present invention envisions a differential readout for
the floating diffusion signal on capacitor C
4 and the reset level on capacitor C
5 via differential amplifier 31, and a second differential readout for the photodetector
signal level on capacitor C
6 and the reset level on capacitor C
5 via differential amplifier 32, thus providing true correlated double sampling for
the photodetector signal level. The final output signal can then be determined by
several means. One is reading the signals from the two differential amplifiers 31
and 32 separately providing two signal values per pixel that can be added off-chip.
A second embodiment is accomplished by providing the signals as inputs to a third
amplifier and subsequent signal processing chain in order to read out the signal out
as a single level per pixel. This readout method of combining the signal in the voltage
domain also provides a larger maximum pixel signal level Vmax than combining the signals
in the charge domain. This is because the floating diffusion does not have to hold
the integrated photodetector signal and integrated floating diffusion signal simultaneously.
Hence the Vmax is extended to be the full floating diffusion capacity plus the photodetector
capacity.
[0016] Since this method utilizes differential readout of the pixel with respect to a reference
reset level, the pixel offset noise is cancelled. Additionally the dynamic range is
extended without any additional components in the pixel, so that it can be accomplished
with small pixels that are practical for low cost consumer digital imaging applications.
The sensitivity of the pixel is increased since both the floating diffusion and photodetector
are used for integration, providing a larger photoactive area in the pixel. Since
the floating diffusion is integrating charge created from light incident on the floating
diffusion rather than collecting charge that blooms from the photodetector, fixed
pattern noise from variation of the point at which charge blooms from the photodetector
is eliminated. With this approach pixel read noise of charge integrated on the floating
diffusion will be increased due to the reset level being uncorrelated to the floating
diffusion signal level. This will be typically less than 30 electrons and is small
compared to the gain in effective signal level.
[0017] As a result of the operation described for Fig. 2 the sensor output response will
be as shown in Figures 3a and 3b. The output response comprises two regions. For low
light levels the output response will follow linear region 1. The slope of linear
region 1 is a superposition of the responses provided by the photodetector and the
floating diffusion, and is proportional to the integration time of both the photodetector
and floating diffusion. As the number of photoelectrons exceeds the capacity of the
photodetector, this charge will flow through the lateral overflow region and be removed
via the reset drain or VDD of the adjacent pixel. The photodetector signal charge
will saturate at this point referred to as V
pdsat. At this point the pixel output response will follow linear region 2. The preferred
embodiment provides a linear response in linear region 2, by the timing shown in Fig.
2. The slope of linear region 2 is dependent on and directly proportional to the floating
diffusion integration time t
intfd. The two Figures (3a and 3b) illustrate the two different slopes for linear region
1 and linear region 2. The floating diffusion integration time in Fig. 3a is shorter
than that for Fig 3b. Consequently, the slope of linear region 1 and linear region
2 in Fig 3b is greater than that for Fig. 3a.
[0018] The dynamic range is extended in two ways. First, since the floating diffusion region
is used to integrate and store photoelectrons, the maximum capacity of electrons is
larger than just using the photodetector. Second, by using different integration times
for the photodetector and floating diffusion regions, an effective or extrapolated
signal level, Veff, can be determined from the ratio of the integration times of the
photodetector and floating diffusion, the ratio of responsivities of the photodetector
and floating diffusion, and the measured signal level from each. Since the ratio of
the photodetector integration time t
intpd to the floating diffusion integration time t
intfd can be made large, Veff can be increased substantially over the signal limited by
the photodetector and floating diffusion capacity.
[0019] It is also possible to display the sensor output signal directly without determining
the effective signal level from linear region 2. This still provides extended instrascene
dynamic range by mapping and directly displaying a larger incident illuminant range
into the directly detectable signal voltage range. This direct output response is
what is illustrated in Figs. 3a and 3b.
[0020] The timing diagram shown in Fig. 2 shows the preferred embodiment of separate readouts
of the charge on the floating diffusion and the photodetector. In this case, the signals
are combined in the voltage domain. The readout could also be accomplished via a single
readout where the signal charge in the photodetector is transferred to the floating
diffusion and the combined charge is readout as shown in Fig. 4. This has the advantage
of a single readout and thus faster readout time, but has the disadvantage of smaller
effective charge capacity, and an uncorrrelated differential readout.
[0021] The second embodiment of the present invention utilizes the method of separate readouts
of charge from the floating diffusion 28 and photodetector 22 combined with two different
color filters 1 and 2 provided over the photodetector 22 and floating diffusion 28
within a given pixel 20. This is shown in Fig. 5. With this invention, signal levels
associated with two different colors can be obtained and separately quantified from
each pixel site. Referring to Fig. 5, the second embodiment of the present invention
is illustrated wherein charge that has accumulated on the floating diffusion 28 is
stored on capacitor C
6 by timing signal SHS
fd. In a manner consistent with the timing diagram shown in Fig. 2, the reset signal
is applied to the reset gate (RG) 27 after the SHS
fd signal resulting in a reset of the floating diffusion 28 and that potential level
of the floating diffusion 28 is then stored on capacitor C
5 by application of timing signal SHR. Charge that has accumulated within the photodetector
22 is then transferred to the floating diffusion 28 by timing signal TG. This photodetector
22 charge on the floating diffusion 28 is then stored on capacitor C
4 by activation of the timing signal SHS
Pd. The preferred embodiment of the present invention envisions that a differential
readout be employed to read the floating diffusion 28 signal level of color filter
1 on capacitor C
4 using the reset level on capacitor C
5 as a reference input into differential amplifier 31. A second differential readout
for the photodetector 22 signal level of color filter 2 on capacitor C
6 via differential amplifier 32 with the reset level on capacitor C
5 again as the reference input, thus providing true correlated double sampling for
the photodetector 22 signal level. The final output signal can then be determined
by several means. One is reading the signals from the two differential amplifiers
31 and 32 separately providing two signal values per pixel that can be added off-chip.
It is envisioned that the output of the second embodiment be derived by providing
the color filter 1 and color filter 2 signals as inputs to a third amplifier and signal
processing chain to read out the signal out as a single color difference level per
pixel. This could also be done in any manner that provided either a color difference
or color addition in the analog voltage domain per pixel, or any manner that uses
the two color signals from within a single pixel or from neighboring pixels to obtain
a desired combination of those signals.
[0022] Another method of deriving the final output signal within the second embodiment is
to have one of the colors be representative of white light. In this version of the
second embodiment the color filter would actually be an empty space over either the
floating diffusion 28 or the photodetector 22. Preferably, the empty space is created
over the floating diffusion 28 or photodetector 22 by having no color filter thus
yielding a white filter. Because the white filter would accumulate photoelectrons
faster than the color filter over the photodetector 22 or floating diffusion 28, the
sensitivity of the pixel 20 can be increased while maintaining a color signal associated
with each pixel 20. With this method the image sensor could be used as either a color
or monochrome sensor.
[0023] Another method is to provide a green color filter associated with the photodetector
or floating diffusion region in each pixel. In this embodiment, a more accurate luminance
sample per pixel can be created. Prior art devices will typically create the luminance
channel at each pixel from interpolation of color filtered light samples of adjacent
pixels. This can provide lower noise images since noise associated with color filter
interpolation will not be present. Also, digital imaging techniques can be expanded
and altered to employ the features provided by the present invention.
[0024] Although not shown in the diagrams this approach can be done with many variations
obvious to those skilled in the art. For example, the photodetector could be a photogate,
the reset transistor could be replaced by any reset means, the lateral overflow region
could be a lateral overflow gate, or other overflow means, the row select transistor
could be replaced by any row select means. Each pixel could have a different color
pair.
1. A semiconductor based X-Y addressable imager having an imaging array comprising a
plurality of pixels:
at least one pixel within the X-Y addressable imager having a photodetector configured
to sense a first bandwidth of light, a sense node the pixel configured to sense a
second bandwidth of light, a reset mechanism operatively configured to the photodetector
and the sense node to allow resetting each of the photodetector and the sense node
to a predetermined potential, the sense node being formed such that it does not have
a light shield allowing the sense node to act as a second photodetector and a transfer
mechanism within the pixel configured to transfer charge from the photodetector to
the sense node.
2. The X-Y addressable sensor of claim 1 wherein the first and second bandwidths are
different
3. The X-Y addressable sensor of claim 1 wherein the first and second bandwidths are
the same.
4. The X-Y addressable imager of claim 1 wherein the imaging array is further placed
within a system comprising:
a first storage mechanism to store a signal associated with charge accumulated on
the sense node;
a second storage mechanism to store a signal associated with charge accumulated on
the photodetector; and
a timing circuit for controlling the integration and transfer timing of the sense
node and the photodetector for the pixel.
5. The system of claim 4 wherein the timing mechanism further comprises a sense node
sampling signal to store a sense node signal proportional to the charge that has accumulated
in the sense node within the first storage mechanism, a reset signal to reset the
sense node after charge accumulated in the sense node has been stored in the first
storage mechanism, a transfer signal to transfer charge accumulated within the photodetector
to the sense node after the sense node has been reset by the reset signal and a photodetector
sampling signal to store a photodetector signal that is proportional to charge that
has accumulated in the photodetector within the second storage mechanism.
6. The system of claim 5 further comprising a reset storage device and wherein the timing
mechanism further comprises a reset sampling signal to sample a reset potential of
the sense node for each of the plurality of pixels and a circuit capable of determining
the difference between the sampled reset potential and either the first or second
storage mechanisms.
7. The system of claim 4 further comprising a reset storage device and wherein the timing
mechanism further comprises a reset sampling signal to sample a reset potential of
the sense node for each of the plurality of pixels and a circuit capable of determining
differences between the sampled reset potential and both the first storage means and
the second storage means.
8. A semiconductor based X-Y addressable MOS imager comprising a plurality of pixels:
at least one pixel within the X-Y addressable MOS imager having a photodetector,
a sense node within the pixel coupled to the photodetector through a transfer mechanism,
a reset mechanism operatively configured to the photodetector and the sense node to
allow resetting each of the photodetector and the sense node to a predetermined potential,
and wherein the sense node is formed such that it does not have a light shield allowing
the sense node to act as a second photodetector, and the pixel further comprising
a transfer mechanism configured to transfer charge from the photodetector to the sense
node.
9. The X-Y addressable MOS imager of claim 8 wherein the imager is placed within a system,
the system further comprising:
a first storage mechanism used to store a signal level associated with charge accumulated
on the photodetector;
a second storage mechanism used to store a signal level associated with charge accumulated
on the sense node; and
a timing circuit for controlling the integration and transfer timing of the pixel.