METHOD OF MAKING A CHARGE COMPENSATION SEMICONDUCTOR DEVICE USING DIRECT BONDING AND CORRESPONDING DEVICE - Patent 1119871

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EP 1 119 871 A1

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(43)	Date of publication:
	01.08.2001 Bulletin 2001/31

(21)	Application number: 00945881.1

(22)	Date of filing: 04.07.2000

(51)	International Patent Classification (IPC)⁷: H01L 21/18, H01L 21/336, H01L 29/06, H01L 29/78

(86)	International application number:
	PCT/EP0006/332

(87)	International publication number:
	WO 0106/550 (25.01.2001 Gazette 2001/04)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

15.07.1999 GB 9916520

(71)	Applicant: Koninklijke Philips Electronics N.V.
	5621 BA Eindhoven (NL)

(72)	Inventor:
	GROVER, Raymond, J. NL-5656 AA Eindhoven (NL)

(74)	Representative: Stevens, Brian Thomas
	Philips Corporate Intellectual Property,Cross Oak Lane Redhill, Surrey RH1 5HA Redhill, Surrey RH1 5HA (GB)

(54)	METHOD OF MAKING A CHARGE COMPENSATION SEMICONDUCTOR DEVICE USING DIRECT BONDING AND CORRESPONDING DEVICE