(19)
(11) EP 1 122 776 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
06.06.2007 Bulletin 2007/23

(45) Mention of the grant of the patent:
04.04.2007 Bulletin 2007/14

(21) Application number: 01301093.9

(22) Date of filing: 07.02.2001
(51) International Patent Classification (IPC): 
H01L 21/82(2006.01)
H01L 21/68(2006.01)
H01L 21/00(2006.01)
 H01L 21/58(2006.01)
H01L 21/78(2006.01)

(54)

Process for producing semiconductor chips

Verfahren zur Herstellung von Halbleiterchips

Procédé de fabrication de puces semiconductrices

(84) Designated Contracting States:
DE FR GB IT PT

(30) Priority: 07.02.2000 JP 2000028702

(43) Date of publication of application:
08.08.2001 Bulletin 2001/32

(73) Proprietor: Lintec Corporation
Tokyo 173-0001 (JP)

(72) Inventors:
  • Noguchi, Hayato
    Gunma (JP)
  • Ebe, Kazuyoshi
    Minamisaitama-gun, Saitama (JP)

(74) Representative: Piésold, Alexander James 
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)


(56) References cited: : 
EP-A- 0 884 766
US-A- 5 641 714
 US-A- 5 525 422
US-A- 5 824 177
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).