Flip-Chip mounted electronic device with multi-layer electrodes

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(11)

EP 1 128 423 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	10.03.2004 Bulletin 2004/11

(43)	Date of publication A2:
	29.08.2001 Bulletin 2001/35

(21)	Application number: 01400488.1

(22)	Date of filing: 23.02.2001

(51)	International Patent Classification (IPC)⁷: H01L 21/60, H01L 23/485

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

25.02.2000 JP 2000049445
22.01.2001 JP 2001013514

(71)	Applicant: Murata Manufacturing Co., Ltd.
	Nagaokakyo-shi Kyoto-fu 617-8555 (JP)

(72)	Inventor:
	Taga, Shigeto, c/o (A170) I. Property Department Nagaokakyo-shi, Kyoto-fu 617-8555 (JP)

(74)	Representative: Joly, Jean-Jacques et al
	Cabinet Beau de Loménie 158, rue de l'Université 75340 Paris Cédex 07 75340 Paris Cédex 07 (FR)

(54)	Flip-Chip mounted electronic device with multi-layer electrodes

(57) An electronic element (2) adapted for a facedown mounting, includes a substrate (3), an electrode provided on the substrate, an electrode pad (6-8) connected to the electrode, an upper electrode (11) disposed on the electrode pad and connected to a metallic bump (10), and an intermediate electrode (12) located between the electrode pad (6-8) and the upper electrode (11). The intermediate electrode (12) preferably includes a single layer made of a metal other than a metal constituting the electrode pad or the upper electrode, and a thickness thereof exceeds approximately 50 nm.

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