THREE-DIMENSIONAL PACKAGING TECHNOLOGY FOR MULTI-LAYERED INTEGRATED CIRCUITS - Patent 1135802

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EP 1 135 802 A1

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(43)	Date of publication:
	26.09.2001 Bulletin 2001/39

(21)	Application number: 98937138.0

(22)	Date of filing: 27.07.1998

(51)	International Patent Classification (IPC)⁷: H01L 23/528, H01L 23/538, H05K 7/20

(86)	International application number:
	PCT/US9815/477

(87)	International publication number:
	WO 0007/240 (10.02.2000 Gazette 2000/06)

(84)	Designated Contracting States:
	DE FR GB IT

(71)	Applicant: REVEO, INC.
	Elmsford, NY 10523 (US)

(72)	Inventor:
	FARIS, Sadeg, M. Pleasantville, NY 10570 (US)

(74)	Representative: Whitten, George Alan
	R.G.C. Jenkins & Co.,26 Caxton Street London SW1H 0RJ London SW1H 0RJ (GB)

(54)	THREE-DIMENSIONAL PACKAGING TECHNOLOGY FOR MULTI-LAYERED INTEGRATED CIRCUITS