(19)
(11) EP 1 141 735 A2

(12)

(88) Date of publication A3:
23.11.2000

(43) Date of publication:
10.10.2001 Bulletin 2001/41

(21) Application number: 99968547.2

(22) Date of filing: 22.12.1999
(51) International Patent Classification (IPC)7: G01R 31/316
(86) International application number:
PCT/US9930/916
(87) International publication number:
WO 0039/848 (06.07.2000 Gazette 2000/27)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 31.12.1998 US 224673
31.12.1998 US 224166

(71) Applicant: FORMFACTOR, INC.
Livermore, CA 94550 (US)

(72) Inventors:
  • ELDRIDGE, Benjamin, N.
    Danville, CA 94523 (US)
  • KHANDROS, Igor, Y.
    Orinda, CA 94563 (US)
  • PEDERSEN, David, V.
    Scotts Valley, CA 95066 (US)
  • WHITTEN, Ralph, G.
    San Jose, CA 95132 (US)

(74) Representative: Käck, Jürgen 
Kahler, Käck, Fiener et Col.Vorderer Anger 268
86899 Landsberg
86899 Landsberg (DE)

   


(54) TEST METHOD AND ASSEMBLY INCLUDING A TEST DIE FOR TESTING A SEMICONDUCTOR PRODUCT DIE