(19)
(11)
EP 1 145 132 A3
(12)
(88)
Date of publication A3:
27.09.2001
(43)
Date of publication A2:
17.10.2001
Bulletin 2001/42
(21)
Application number:
99932038.5
(22)
Date of filing:
30.06.1999
(51)
International Patent Classification (IPC)
7
:
G06F
13/42
(86)
International application number:
PCT/US9914/696
(87)
International publication number:
WO 0000/2134
(
13.01.2000
Gazette 2000/02)
(84)
Designated Contracting States:
CH DE ES FI FR GB LI SE
(30)
Priority:
01.07.1998
US 91383 P
11.02.1999
US 248939
(71)
Applicant:
QUALCOMM Incorporated
San Diego, California 92121 (US)
(72)
Inventor:
JHA, Sanjay, K.
San Diego, CA 92121 (US)
(74)
Representative:
Geyer, Ulrich F., Dr. Dipl.-Phys. et al
WAGNER & GEYER,Patentanwälte,Gewürzmühlstrasse 5
80538 München
80538 München (DE)
Remarks:
WIPO A3 publication data is not currently available.
(54)
IMPROVED INTER-DEVICE SERIAL BUS PROTOCOL