USE OF ADDITIONAL BONDING FINGER ROWS TO IMPROVE WIRE BOND DENSITY - Patent 1145309

(19)

(11)

EP 1 145 309 A2

(12)

(43)	Date of publication:
	17.10.2001 Bulletin 2001/42

(21)	Application number: 00972400.6

(22)	Date of filing: 07.09.2000

(51)	International Patent Classification (IPC)⁷: H01L 23/00

(86)	International application number:
	PCT/US0040/845

(87)	International publication number:
	WO 0120/669 (22.03.2001 Gazette 2001/12)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

(30)

Priority:

16.09.1999 US 397612

(71)	Applicant: Philips Semiconductors Inc.
	Sunnyvale, CA 94088 (US)

(72)	Inventors:
	LAU, Daniel, Kwok San Francisco, CA 94132 (US) MARTIN, Robert, J., III Salida, CA 95368 (US) HAMZEHDOOST, Ahmad Sacramento, CA 95828 (US)

(74)	Representative: Smeets, Eugenius Theodorus J. M.
	INTERNATIONAAL OCTROOIBUREAU B.V.,Prof. Holstlaan 6 5656 AA Eindhoven 5656 AA Eindhoven (NL)


	Remarks:
	WIPO A3 publication data is not currently available.

(54)	USE OF ADDITIONAL BONDING FINGER ROWS TO IMPROVE WIRE BOND DENSITY